Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Mon Aug 16 00:05:52 EDT 1999 | Will Grubb
Hello I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce whi
Electronics Forum | Mon Aug 16 04:38:18 EDT 1999 | Earl Moon
| Hello | I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce
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Used SMT Equipment | Pick and Place/Feeders
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Used SMT Equipment | Pick and Place/Feeders
1. Manufacturing location of yamaha medium-speed placement machine 2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-
Parts & Supplies | SMT Equipment
ORIGINAL SMT MACHINE PARTS JUKI 2080 EJECTOR 80 ASM 40050035 MC5M10HSV8S24B JUKI PARTS Specifications: Brand Name JUKI EJECTOR Part Number 40050035 Model Number MC5M10HSV8S24B Ensure Tested buy juki Guarantee 1 month usage for machine JU
Parts & Supplies | Pick and Place/Feeders
JUKI KE2010 HEAD MAIN PWB ASM E86137290A0 Other juki parts: E86127250A0 OCC LIGHT CIRCUIT BOARD A ASM. E86127290A0 HEAD RELAY PWB ASM. E8612729AA0 HEAD TOP COVER A ASM. E8612729BA0 HEAD RELAY PWB B ASM E8612729CA0 HEAD RELAY PWB C ASM E8613700
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Events Calendar | Tue Aug 28 00:00:00 EDT 2018 - Thu Aug 30 00:00:00 EDT 2018 | ShenZhen, China
NEPCON South China 2018
Career Center | Garland, Texas USA | Sales/Marketing
Electronics Manufacturing Company is looking for FT/PT full commission sales personnel, 25% and up commission base on value of orders ( not the bottom line). Experience on handling own sales accounts. Extra income for referrals, if you have business
Career Center | Hawthorne, California USA | Production
MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
(Flex) BGA Using a Polyimide Tape Substrate Trent
| https://www.smtfactory.com/I-C-T-Establish-Strong-Connections-with-Local-Partners-Russian-Station-id40558437.html
I.C.T | Establish Strong Connections with Local Partners - Russian Station - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Head-in-pillow One of the most commonly looked for defects is Head-In-Pillow or HIP. Often seen in Ball Grid Array (BGA) device connections post reflow, where the BGA ball and solder paste on the PCB pad do not form a cohesive joint
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