Industry Directory | Manufacturer
MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.
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PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
MICROFOCUS X-RAY 3D/CT SYSTEM VX-9100 The VX-9100 3D X-Ray Inspection Machine is a state-of-the-art industrial microfocus CT system designed for precise quality inspection and non-destructive analysis of electronic components. Its advanced cap
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Wed Aug 30 23:45:23 EDT 2006 | ppcbs
Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a m
Electronics Forum | Wed Aug 30 23:45:40 EDT 2006 | ppcbs
Since BGA's are sensitive to contamination in the plating process, I always do a simple solderability test whenever we receive a new batch of boards. Take a board from the batch, apply no clean flux on the BGA site, then try to tin the pads with a m
Industry News | 2016-02-10 15:50:38.0
SMTA is excited to announce the finalized program and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held April 12-14, 2016 at the Eastin Hotel in Penang, Malaysia.
Industry News | 2017-02-05 10:18:08.0
The SMTA is pleased to announce its 2017 Educational Programming that includes conferences, webtorials and webinars, certification program and online training courses.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
SMTnet Express, Septemeber 8, 2016, Subscribers: 26,370, Companies: 14,943, Users: 41,052 How Clean is Clean Enough – At What Level Does Each of The Individual Contaminates Cause Leakage and Corrosion Failures in SIR? Terry Munson, Paco Solis
Baja Bid | https://bajabid.com/tempo-automation-auction/
: Asys Divisio 2100 Board Router (2018) Wash : Aqua Kleen Typhoon T-20 Inline Wash (2018) Aqueous Technologies Zero-Ion G3-24 Contamination Tester (2017