Industry Directory | Equipment Dealer / Broker / Auctions
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
► Exclusive 10MP / 18MP Camera Technology ► Precision Telecentric Compound Lens Design ► Eight Phase Color Lighting System ► 10MP / 18MP SIDE-VIEWER® Camera System ► Extremely Simple Programming and Operation ► Integrated INTELLI-BEAM® L
► Exclusive 10MP / 18MP Camera Technology ► Precision Telecentric Compound Lens Design ► Eight Phase Color Lighting System ► 10MP / 18MP SIDE-VIEWER® Camera System ► Extremely Simple Programming and Operation ► Integrated INTELLI-SCAN® L
Electronics Forum | Wed Dec 27 17:13:28 EST 2000 | John K.
As part of an Intel erratum, they changed their BGA coplanarity spec from .006" to .008". The package is 23 X 23 partial array, .050"(1.27) pitch, 1.220"(31) square. We apply paste onto BGA pads with a 6-mil stencil. From a process perspective, sh
Electronics Forum | Thu Feb 20 17:18:24 EST 2003 | davef
Give us infortmation, please. What is [are]: * Height board to board side of the interposer on the low side of uBGA * Height board to board side of the interposer on the high side of uBGA * Alloy of solder balls, no paste was used correct? * Type of
Used SMT Equipment | Chipshooters / Chip Mounters
1999 Fuji IP-III SMT Pick & Place Note: This lot contains two items. (1) Fuji IP-III SMT Pick & Place Approx Dimensions: 126" x 78" x 78" (1) Fuji MTU-4R Tray Tower Approx Dimensions: 43" x 87" x 70" Location: Jasper, IN USA Serial: 1514 Features: o
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2011-09-19 16:37:06.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it will premier its complete line of AOI systems in Booth #124 at SMTA International 2011.
Industry News | 2017-04-03 15:02:09.0
MIRTEC today announced they are participating in the upcoming What's New in Electronics Live! event. They will exhibit in booth #8. They will exhibit in booth #327. The show is scheduled for May 9-10 and will take place at the National Exhibition Center in Birmingham, UK.
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JUKI FX-1 E2155725000 AWC BELT (M L) E21517150A0 FRONT RAIL S ASM. E2151723000 RUBBER RING E2151725000 AWC BRACKET F E2151802000 STOPPER BRACKET RA E21527150A0 REAR RAIL S ASM. E2152721000 DRIVE SHAFT C E21527230B0 PAD BLOCK ASM E2152729AA0
Parts & Supplies | AOI / Automated Optical Inspection
CAL PIECE A E3622721000 for JUKI750 2050 E36117060A0B REEL HOOK 12 ASM. E3613706A00 REEL_PRESSER_12-56 E3614706A00 REEL SUPPORT SH COLLER E3614706AA0 REEL SUPPORT SH COLLER E3615706A00 REEL_BRAKE E36217210A0 CAL PIECE ASM. (730) E3622721000 C
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Mon May 04 00:00:00 EDT 2020 - Mon May 04 00:00:00 EDT 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Downers Grove, Illinois USA | Engineering,Production
Opportunities for SMT professionals with experience in: --Generating DFM --Re-Flow Process Knowledge --BGA Placement and Inspection --Generating Pilot Reviews --Create Solder Paste Stencils --Machine Programming
Career Center | , California | Quality Control
Tammy T Vo P.O. Box 2213 (714) 254-5073 E-mail: nhutamvo@yahoo.com Position of Interest Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications 12 years of experience wo
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
The Industry Requirement for 2D and 3D Inspection Technology in a Single AOI Platform SMTnet Express November 21, 2012, Subscribers: 26000, Members: Companies: 9045, Users: 33968 The Industry Requirement for 2D and 3D Inspection Technology in a
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?con=t&page=9
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Test and Inspection Products Content Your results for: Test and Inspection Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE Great Perspective X-Ray Inspection and Test Products 25th March, 2022 Nordson
| https://www.feedersupplier.com/sale-13018909-smt-koh-young-ky8030-3-spi-inspection-machine.html
) Foreign Material Inspection 3D Foreign Material lnspection(optional) Inspection Items Metrology Capability Volume, Area, Height, Offset, Bridging, Shape Deformity, Coplanarity Types of Defects lnsufficier1t/Excessive/Missing Paste, Bridging, Shape Deformity, Paste
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
