Industry Directory | Manufacturer
Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Electronics Forum | Tue Jul 25 11:30:47 EDT 2006 | DC
Russ, we had similiar issue on the corner seperation. The board is ENIG and the part is Altera FBGA 1020 (Super BGA) and reflowed by tin/lead paste. Please comment your concern on Altera parts! Is CTE mismatch?
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
Used SMT Equipment | Chipshooters / Chip Mounters
30 intelligent spindle assemblies -> All vision processing is performed “on the fly” to maximize throughput. -> Continuous updates of X, Y, and Z-height pickup and placement locations ● On-The-Head Cameras -> narrow field of view c
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2022-04-11 21:59:08.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Parts & Supplies | Repair/Rework
Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking
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Parts & Supplies | Pick and Place/Feeders
CYBEROPTICS laser/CYBEROPTICS camera:JUKI laser(570/620/730/740/750/760/2010/2020/2030/2040/2050/2060/2070/2080/KJ-01/KJ-02//FX-1/FX-2/FX-3/3020R/JX-100 laser unit),YAMAHA laser,SAMSUNG laser,TENRYU laser,PHILIPS(ASSEMBLEON) FCM PPU laser,Autotronik
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall
SMTnet Express, April 5, 2018, Subscribers: 30,982, Companies: 10,916, Users: 24,587 High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
BGA/CSP component was influenced by the void size and location. It is industry general knowledge [11, 12] that the outer row/corner solder ball locations of a BGA/CSP package are the maximum stress/strain locations (excluding component silicon die CTE
