Industry Directory | Manufacturer
VJ Technologies, Inc. offers leading-edge solutions for the most advanced X-ray imaging applications.
Industry Directory | Consultant / Service Provider / Manufacturer
EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018
New Equipment | Rework & Repair Equipment
Scotle IR360 PRO is a 2 in 1 BGA rework station which can be used as infrared BGA rework station and hot air BGA Rework station with three independently temperature zones. Users can use total different BGA rework system only in one BGA rework station
New Equipment | Rework & Repair Equipment
Specification: Rated Power: 4000W Rated voltage:AC220V /AC110V optional The first upper zone power: 800W Second temperature lower power: 800W Lower part of the preheating temperature zone Power: 2400W Dimensions: L500mm * W420mm * H550mm Weigh
Electronics Forum | Mon Aug 25 06:43:37 EDT 2008 | callckq
Dear All, Recently, we found a strange defect called "Head-in-pillow" defect at CPU socket BGA. The strange thing here is that this problem only appear on that CPU socket BGA and not on the others BGA which were also mounted on the PCB. We suspect
Electronics Forum | Sun Jun 05 13:42:16 EDT 2005 | amigo
We find it impossible to remove the glued micro-BGA chips like the CPU and the UEM ICs used in Mobile Phones. They are both surface mount devices and glued with some chemicals we think. Any help is most needed in this matter.
Used SMT Equipment | Repair/Rework
BGA 3101: Control Box BGA 3591:Main system CPU, monitor, keyboard, mouse, etc. Manual Nozzles and spares This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional eith
Used SMT Equipment | Pick and Place/Feeders
Autotronik-SMT P&P machine BS384V1, equipped with Martin Clever-Dispens-04 Unit, 3x32 Feeder port Bases, Feeders: 8mm - 35pcs, 12mm - 10pcs, 16mm - 6pcs, 24mm - 1pcs, 20 tubes vibro feeder 1pcs, Cut tape tray for 10x8mm tapes, spare parts and a
Industry News | 2013-04-10 11:30:23.0
VJ Electronix, Inc., announces a recent increase in demand for its Summit LX large format PCB rework systems in its fiscal first quarter.
Industry News | 2010-07-12 13:45:17.0
VJ Electronix Inc., the leader in Rework technologies and global provider of advanced X-ray inspection systems, announces that it will exhibit and demonstrate X-ray and Rework solutions in distributor Kasion’s booth 2C41 at the upcoming NEPCON South China 2010 exhibition and conference.
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Parts & Supplies | Pick and Place/Feeders
JUKI 710 head motherboard E8621715BA0 E86227150A0 Other juki parts: E86217210A0 BGA BOARD ASM E86217290A0 TEMPERATURE SENSOR PWB ASM. E86227150A0 HEAD SUB UNIT BASE ASM. E86227290A0 LIGHT 2 PWB ASM. E86237000A0 HEAD RELAY CIRCUIT BOARD ASM E86
Parts & Supplies | Pick and Place/Feeders
JUKI 710 Sony Sensor PK15-3 411 Other juki parts: E86217210A0 BGA BOARD ASM E86217290A0 TEMPERATURE SENSOR PWB ASM. E86227150A0 HEAD SUB UNIT BASE ASM. E86227290A0 LIGHT 2 PWB ASM. E86237000A0 HEAD RELAY CIRCUIT BOARD ASM E86237150A0 HEAD MOTO
Metcal BGA 3591 video demonstration by Capital Equipment Exchange.
In this video, you will know the bga rework machine how to hot air. After watched it, please give Joy Rong a " like", thank you for your support. Product Application 1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
Lewis & Clark | http://www.lewis-clark.com/product-tag/rework-station/
: Standard Onyx 29 Automated Assembly Linear Air Knife Air Cooling System Fume Extraction (as depicted in photos below) Automated Component Pick up Shuttle Workstation DRS Custom with CPU Stand Dispenser
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
. The smaller form factors and the increased component population continue to shrink keep-out-zone (KOZ) dimensions between CSP/BGA and other board components
