Industry Directory | Manufacturer
CASE is a full service electronics contract manufacturer specializing in multi layer double sided surface mount, micro BGA's, flip chip, csp, and the highest of technology. A company built on customer service. New Englands most well equipped electronics facility
Industry Directory | Consultant / Service Provider / Manufacturer
A Top-25 global EMS provider headquartered in Burnaby, BC, Canada
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
The NexJet® 8 Jetting System with patented ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. ReadiSet Jet Cartridge reduces operator training time, cost-of-owner
Used SMT Equipment | Coating and Encapsulation
Make: PVA Model: Delta 6 Vintage: 2014 Power: 240v, 25A, 60hz PSI: 80-100 3 Axis Fiducial Camera Belt Conveyor PCB Heat JDX + PVA Jet Controls (IO Card) Vacuum Purge Weigh Scale Machine was configured for Underfill, Flip Chip, BGA, Flex a
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com
The NexJet® 8 System with ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. Read more at http://www.nordsonasymtek.com/nexjet
Career Center | , | Engineering
Job description This position is for a Mechanical Engineer involved in supporting, developing, and improving microelectronics manufacturing processes to optimize Quality, On-Time Delivery, and Cost with an emphasis on Safety. Implementation of Lean M
Career Center | Flower Mound, Texas USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
SMT and THT Soldering Process Optimization Working knowledge of MPM Screen Printers, Fuji and Siemens Placement Equipment, BTU, ERSA and Vitronics Reflow Ovens, Camalot 3500 Underfill Dispense Machine, SEHO and Electrovert Wave Soldering Systems
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/fluid-dispensing-systems/quantum-q-6800-high-value-fluid-dispensing-system
and other electronic assembly applications including: CSP, BGA and board-level underfill Corner and edge bonding Dam and fill Potting and encapsulation Surface mount adhesives Conductive epoxy Larger board or substrate size
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