Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer's Representative
KIC Thermal Profiling KIC2000 Cheap wholesale KIC Thermal Profiling KIC2000 BGA rework station Cheap wholesale KIC Thermal Profiling KIC2000 KIC Thermal Profiling KIC2000 Cheap wholesale KIC Th
Industry Directory | Consultant / Service Provider / Manufacturer / Research Institute / Laboratory / School
SMT & PCBA Laboratory Services, X-ray inspection, BGA rework, BGA Reballing, Solder Failure Analysis, SMT Assembly Process Validation, SMT Assembly Process Training & Consulting.
New Equipment | Rework & Repair Services
BGA Rework Station Services for: SRT 1000, 1100, 1100HR, 2000 plus , Shuttle Star and Zhuomao Brands. Calibration Profile Set Up Computer Repair, and hard drive replacement. Used machine sales. Machine installation and set up. BGA Rework Tra
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Tue Sep 26 18:06:13 EDT 2006 | russ
could be black pad, or it is just bad reflow profile that did not get all balls soldered down. OR it could be a planarity issue between BGA and fab during assembly. Can we assume that this is proven design? Somewtimes in new design touching a BGA
Used SMT Equipment | SPI / Solder Paste Inspection
SPI PARMI SPI HS60L PARMI solder paste inspection machine SPI HS60 product introduction: 1. The SPI HS60 Series series is PARMI's best-selling model. It has been installed in excellent SMT production sites around the world. Its performance st
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411, Samsung SM411 Mounter, Second-hand Samsung SM411 Chip Shooter Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH an
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
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Parts & Supplies | Assembly Accessories
12MM Calibration Tape .12MM Calibration Tape 20 Inch Folding Bike Ravel Case 20 Inch Folding Bike ravel Case 4*4.1200pcs/bag M0604 8MM Calibration Tape .8MM Calibration Tape 90 degree drive set 90 degree drive set A2E BGA Rework Station Temp Con
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2018-04-27 13:23:31.0
When performing BGA component rework, it is important to know the actual heat that is coming out of the top and bottom heaters. This will be critical in setting up accurate heat profiles. Monitoring your heat output will also keep you aware of your heaters performance so that you will know when the heaters need to be replaced.
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Demo on how to reball a BGA component using a universal reball fixture.
Exploring the software operation of an SRT 1000 BGA Rework Station. Profile set up and basic software operation. http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Austin, Texas USA | Production,Quality Control
Join an exciting downstream, solid pre-IPO company in the rolling hills of Austin. Work alongside an elite team of engineers with an excellent track record of success in the telecom industry! Their high-performance networking product technology is g
Career Center | Williamsport, Pennsylvania USA | Engineering,Management
PRIMUS Technologies Corporation is an electronic manufacturing services (EMS) provider that produces highly reliable products for global government and commercial markets. Our company is an integrated lean enterprise that fully embodies the Six Sigma
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 10, (#ts#)) SMT Express, Volume 2, Issue No. 2 - from SMTnet.com Volume 2, Issue No. 2 Thursday, February 17, 2000
SMTnet Express, December 6, 2018, Subscribers: 31,514, Companies: 10,684, Users: 25,477 Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates Credits: DfR Solutions The multilayer ceramic capacitor (MLCC) has become a widely used
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/profile
Nordson DAGE Company Profile X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] Figure 2 illustrates Weibull plots that show that BGAs with voids (i.e. Mod Profile) and BGAs without voids (i.e. Standard Profile) did not have distinguishable solder joint failure populations. Banks
