Electronics Forum | Thu Feb 14 04:38:43 EST 2008 | marjorie
Anyone knows why BGA fell off sometimes from the board? I was running in a single sided only. I encountered a BGA falling off from the pcb pad. The pcb is ENIG and lead free process. The pads had no solder and didn't looks like having a black pad thr
Electronics Forum | Thu Feb 14 07:34:10 EST 2008 | jdumont
How many fell off out of your entire lot? What was the soldering quality like on the ones that didn't fall off (xray, visual)? You need to determine if its a random problem or if even the ones that stayed on are barely on and go from there. If the o
Industry News | 2023-03-06 17:13:47.0
IPC issues February Economic Outlook report
Industry News | 2015-02-17 02:24:34.0
Precision PCB Services, Inc. the leader in the art of BGA Rework Services and Process Implementation will introduce their line of Shuttle Star BGA Rework Stations at the 2015 IPC APEX Expo.
Technical Library | 2015-01-05 17:38:26.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Last Will And Testament of the BGA Void Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins
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