New Equipment | Rework & Repair Equipment
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Optical aligment bga rework station WDS-700 automatic mobile phone repair machine for galaxy note 4 emmc
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Hottest professional mobile phone repair machine WDS-700 auto bga chipset rework station with free training
Electronics Forum | Thu Aug 17 09:57:16 EDT 2006 | jwn
Hi all, I need to find a solution for a problem I have. I need to replace BGAs which have been glued to a laptop board with superglue (Loctite). How can it be done without removing the pads when trying to remove the foreign glue? thanks in advance
Electronics Forum | Sun Jun 05 13:42:16 EDT 2005 | amigo
We find it impossible to remove the glued micro-BGA chips like the CPU and the UEM ICs used in Mobile Phones. They are both surface mount devices and glued with some chemicals we think. Any help is most needed in this matter.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
I.C.T PCB LED Dispensing Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt,Dispensing Machine,SMT Glue Dispensing Machine,Dispensing
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
