Industry Directory | Standards Setting / Certification / Training Provider / Consultant / Service Provider / Manufacturer
BEST is a certified master IPC Training and Solder Certification center. We provide comprehensive courses for both Instructors and Operators including IPC-A-610, IPC J-STD-001, IPC-A-600, IPC/WHMA-A-620, and IPC 7711/7721 standard
Specialists in SMT assembly systems, BGA assembly, BGA rework, and the MicroMesh stencil system.
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
New Equipment | Education/Training
BEST is an IPC Master Certification Solder Training Center offering Instructor and Operator courses for IPC-A-610, J-STD-001,IPC-A-600, IPC/WHMA 620, IPC 7711/7721 as well as customized classes to meet your specific standard or criteria. Our IPC Trai
Used SMT Equipment | Flexible Mounters
Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma
Used SMT Equipment | SMT Equipment
Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma
Industry News | 2019-05-12 15:58:00.0
Fast Shipment of Custom SRT Nozzles
Industry News | 2016-02-27 20:41:52.0
BEST Inc. instructors will be conducting 2 training sessions this year at the APEX Expo 2016 - Advanced Rework: Hands-on BGA Reballing, Lead-Free Devices, and Fine-Pitch Parts, and the 2nd session - Stencil Printing: Consistent Print Volumes for SMT Rework.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2019-10-16 23:18:15.0
Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
BEST, Inc. is an authorized IPC Training Center and offers the IPC-A-610C Certified Instructor Program. Students who complete the program are considered Class "A" Instructors and are qualified to teach the 2 day Worker Proficiency training and certif
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-7711/IPC-7721 Expert (CSE)
The IPC-7711/IPC-7721 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-7711/IPC-7721 standard.
Events Calendar | Sun May 03 18:30:00 UTC 2020 - Sun May 03 18:30:00 UTC 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | Flexible City and State, California USA | Technical Support
Position: Field Service Engineer to support Automated X-Ray Inspection (AXI) Equipment for Manufacturing. Responsibilities include, but not limited to: PRIMARY RESPONSIBILITIES: - Provide Hardware Technical support to existing customers; Hard
Career Center | Rochester, New York USA | Engineering
Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes
Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support
9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t
Career Center | Spencerport, New York USA | Management,Production
2.5 years in Fugi SMT placement machines at Kodak. Certified in all machinery. after 1 year with Department i was promoted to Teamleader/Trainer on SMT placement line. I also have experience in Thru hole, BGA, and fine pitch placement. I am certi
Inclusion Voiding in Gull Wing Solder Joints SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565 Inclusion Voiding in Gull Wing Solder Joints First published in the 2012 IPC APEX EXPO technical conference
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/odd-values-ipc7351c-bga-var_topic2466_post10180.html
Odd Values IPC-7351C BGA +Var - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Odd Values IPC-7351C BGA
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/ipc-7711-7721/
Module 8 (Optional for CIS) – BGA Module 9 (Optional for CIS) – Laminate Repair Module 10 (Optional for CIS)- Circuit Repair CERTIFIED IPC SPECIALIST (CIS
