Industry Directory | Consultant / Service Provider / Manufacturer
SPIN PCB offers short run and prototype contract manufacturing services, as well as mid-volume manufacturing solutions. Turnkey or consigned material, lead free processing, through hole, surface mount, bga's, whatever our customers need.
Industry Directory | Consultant / Service Provider / Manufacturer
Full service EMS provider with 4 locations in US
Commercial-off-the-shelf (COTS) PC/104 and PC/104-Plus computer cards and components, including x86 and PowerPC CPUs; DC/DC converter power supplies and interfaces; fan cards and heatsinks; digital I/O and mass storage boards; fieldbus interfaces (C
Ensuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermal cycling and adverse environmental conditions is
Electronics Forum | Thu Nov 08 12:50:22 EST 2012 | jmartens1978
I have a project that I am working on and would like some input from anyone that has some knowledge on High Voltage Arcing on PCBs. Problem: I have a PCB that is enclosed in a plastic enclosure that has metal pins and switch that extend to the outs
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
Industry News | 2011-04-20 21:19:17.0
IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Technical Library | 2016-01-12 11:09:47.0
In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for used in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable.
Technical Library | 2020-10-18 19:35:05.0
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Printed Circuit Board Protection Methods - Conformal Coating Encapsulants Potting Module Sealing Low Pressure Molding
Career Center | Bangor, Maine USA | Engineering
Talent Acquisition Resources, Inc. is a boutique executive search firm that assisting a Client in the Bangor, Maine area in filling an SMT Process Engineer. Responsibilities � Sets up systems to monitor and report quality processes, using SPC to a
Career Center | Raleigh, North Carolina USA | Engineering
Title: SMT PROCESS ENGINEER Salary: 70k-80k max rate with great benefits Job Description: ESSENTIAL DUTIES & RESPONSIBILITIES To perform this job successfully, an individual must be able to perform each essential duty satisfactorily, plus w
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
SMTnet Express, February 12, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing Sabuj Mallik
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Yamaha Electronics Production Machine SMT Label Mechanical Feeder Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
are no limitations in the position of the virtual section plane, virtual sectioning is fully reversible (as it is done on a software model), and no additional mechanical defects are introduced. 175 Figure 32. 26.1% BGA Voids Selected for CT Assessment
