Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Manufacturer
Micro Dynamics has been an employee-owned Electronic Manufacturing Services provider since 1981.
This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Electronics Forum | Tue Sep 09 09:02:39 EDT 2008 | floydf
We are quoting a job that has about 30 50 pin D connectors on one side of the board, and about 10 on the other side. Barring any stroke of genius, we would wave solder one side, and hand solder the other side. Does anyone have any suggestions on how
Electronics Forum | Tue Sep 09 09:33:40 EDT 2008 | dphilbrick
Only with selective solding. Those would be too tall to do a second wave.
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | Repair/Rework
Sierra 1800 BGA Rework Stations (2 stations Available) Vintage: 2011 Both Systems running Windows-Based Sierra Mate SW Version 8.3.9. Advanced Auto Profile, Programmable Pick and Place Force with Component Height Sensing, Independent Top Heater and
Industry News | 2011-08-22 18:45:28.0
MIRTEC, “The Global Leader in Inspection Technology” will premier its complete line of AOI systems in booth #100 at IPC Midwest 2011
Industry News | 2011-09-19 16:37:06.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it will premier its complete line of AOI systems in Booth #124 at SMTA International 2011.
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Parts & Supplies | Pick and Place/Feeders
more than we can offer contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 motor JUKI KE730 Z Axis Motor L404-151EL8 JUKI KE730 T Axis Motor L402-021EL0 23W 24V 1.9A JUKI KE750 X Axis Motor TS4513N1820E200 E9611721000 JUKI K
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Parts & Supplies | Pick and Place/Feeders
more than we can offer contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 motor JUKI KE730 Z Axis Motor L404-151EL8 JUKI KE730 T Axis Motor L402-021EL0 23W 24V 1.9A JUKI KE750 X Axis Motor TS4513N1820E200 E9611721000 JUKI K
Technical Library | 2013-12-19 16:57:50.0
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even though military hardware is considered exempt from the requirements of RoHS. As the supply chain has moved to the new lead free alloys both markets are being forced to understand these impacts and form risk mitigation strategies to deal with the change. This paper documents the effect of mixing Leaded and Lead Free alloys on BGA devices and how this impacts reliability. Three of the most common pitch BGA packages are included in the study to determine if the risk is the same as pitches decrease
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Economic Type Reflow Oven ❙ Introduce of Reflow Oven High quality economic type reflow oven, reflow soldering oven, SMT reflow oven, reflow soldering machine, with 6 zones, 8 zones and 10 zones. 1. Control System Computer or Instrument control,
High Performance Reflow Soldering Oven ❙ Introduce of Reflow Oven High performance reflow soldering oven, SMT reflow oven, soldering oven, SMD soldering machine, for soldering surface mount components to a printed circuit board or PCB. 1.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) INTRODUCTION This article is written to ensure everyone interested
GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-underfill.php
: Dispense on Flip Chip & BGA, Bumped Silicone Die The continuously volumetric dispense technology of PCD pumps is perfect for the capillary underfill process, dispensing a repeatable, uniform volume of fluid around all sides
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/minimum-trace-width-spacing-for-bga_topic1556.html
(plugged from top open on bottom) if not near a pad on the bottom, and VIA18D9A26PTB plugged and cover with solder mask from both sides
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
