Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Manufacturer
Manufacturer of a BGA / QFN / SMT rework stations, reflow soldering equipment, reflow ovens, and smt pick and place machines.
New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Wed Apr 18 01:07:25 EDT 2001 | MW
I some something like this. My package was not flat the belly of the body rested on the PCB. We found that every 4-5 part would wander to the side. What was puzzling is that the blowers would have blown it the opposite side. ultumately we proved
Electronics Forum | Fri Apr 20 16:11:29 EDT 2001 | davef
Good to talk with you too. Oh, just the way I had it pictured!!! Yeh, right!!! [http://davesmt.50megs.com/pictures select kristenna.jpg ] Which part of the antenna "sees" heat first [Are all legs (vertical part), two legs, or one leg of the anten
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Used SMT Equipment | Chipshooters / Chip Mounters
Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to 22mm IC part through On-The-Fly recognition. It also allows recognition of parts with
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Parts & Supplies | Pick and Place/Feeders
JUKI KE-1070 KE-1080 KE-3010 KE-3020 16AXIS 2CH SERVO CONTROLLER 40044540 Other juki parts: 40044531 MAGNETIC SCALE X SENSOR UNIT 40044532 MAGNETIC SCALE Y SENOR UNIT 40044533 SERVO MOTOR 10W HC-BH0336LW4-S4 40044534 SERVO MOTOR 30W 40044535 4A
SMT MACHINE GENUINE Juki Spare Parts JUKI FX-1 FX-2 C OUT SENSOR ASM L832E1210A0 HPJ-A21 Specifications: Brand Name JUKI FX-1 FX-2 C OUT SENSOR ASM Part number L832E1210A0 Model HPJ-A21 Ensure Test in machine confirmation Guarantee 1 mont
Technical Library | 2023-09-26 19:14:44.0
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC) solder balls. Such parts are often assembled to printed circuit boards using traditional 63Sn-37Pb solder paste. The resulting solder joints contain unusual quaternary alloys of Sn, Ag, Cu, and Pb. In addition, the alloy composition can vary across the solder joint based on the paste to ball solder volumes and the reflow profile utilized. The mechanical and physical properties of such Sn-Ag-Cu-Pb alloys have not been explored extensively in the literature. In addition, the reliability of mixed formulation solder joints is poorly understood.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Lead Free Reflow Soldering Machine ❙ Introduce of Reflow Soldering Machine ETA high-end lead free reflow soldering machine, SMT reflow soldering machine, SMT reflow soldering, for LED production line. Imported well-known brands of important p
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | Williamsport, Pennsylvania USA | Engineering,Management
PRIMUS Technologies Corporation is an electronic manufacturing services (EMS) provider that produces highly reliable products for global government and commercial markets. Our company is an integrated lean enterprise that fully embodies the Six Sigma
Career Center | Grand Prairie, Texas USA | Production,Quality Control,Technical Support
SMT Programmering Specialist. Pick and place, screen printer, AOI and quality inspection, process control, CAD and program development.
Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi
Lewis & Clark | https://www.lewis-clark.com/product-tag/used-bga-rework-station/
– Mydata Mycronic Parts – Universal Instruments UIC Pick & Place Press Reflow Oven Rework Station Router Screen Printer Selective Solder Spare Parts SPI Uncategorized Wave Solder X-Ray Search Products
| http://etasmt.com:9060/te_product_j/2019-09-26/6429.chtml
: SMT Reflow Oven Machine Model: SMT Reflow Oven Brief: ETA Draco Draco733 lead-free reflow oven with 10 heating zones and 3 cooling zones ETA Draco 733 reflow oven improve production efficiency, and use important imported brands for important parts
