Industry Directory: bga ped connect (5)

Interconnect Systems, Inc.

Industry Directory | Manufacturer

Semiconductor Enhancement Products

CAD Design Software

Industry Directory | Consultant / Service Provider

CAD Design Software products run in the AutoCAD environment.

New SMT Equipment: bga ped connect (47)

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

New Equipment | Software

ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc.  ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat

UNISOFT Corporation

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

Electronics Forum: bga ped connect (187)

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef

We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.

PBGA open connection

Electronics Forum | Tue Oct 03 09:23:55 EDT 2006 | kenscj

We are encountering BGA solder open connection. At Functional Test, the board failed. Debug guy diagnosed this BGA open connection (2 locations), by using multimeter. Under 5DX inspection, there is connection. Take the board for localised reflow at

Used SMT Equipment: bga ped connect (5)

Yamaha YV100XGP / Y18680

Yamaha YV100XGP / Y18680

Used SMT Equipment | Pick and Place/Feeders

1. Manufacturing location of yamaha medium-speed placement machine  2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-

Qinyi Electronics Co.,Ltd

Yamaha YV100XGP / Y17942

Yamaha YV100XGP / Y17942

Used SMT Equipment | Pick and Place/Feeders

1. Manufacturing location of yamaha medium-speed placement machine  2. YV100XG factory year period 2000-2006; YV100XGP general year: 2005-2007 (now discontinued; only second-hand equipment is on sale in the market) 3. This model is a medium-

Qinyi Electronics Co.,Ltd

Industry News: bga ped connect (101)

Parts & Supplies: bga ped connect (44)

Juki SMT MACHINE PARTS JUKI 2080 EJECTOR 80 ASM 40050035 MC5M10HSV8S24B

Juki SMT MACHINE PARTS JUKI 2080 EJECTOR 80 ASM 40050035 MC5M10HSV8S24B

Parts & Supplies | SMT Equipment

ORIGINAL SMT MACHINE PARTS JUKI 2080 EJECTOR 80 ASM 40050035 MC5M10HSV8S24B JUKI PARTS Specifications: Brand Name JUKI EJECTOR Part Number 40050035 Model Number MC5M10HSV8S24B Ensure Tested buy juki Guarantee 1 month usage for machine JU

KingFei SMT Tech

Juki KE2010 HEAD MAIN PWB ASM E86137290A0

Juki KE2010 HEAD MAIN PWB ASM E86137290A0

Parts & Supplies | Pick and Place/Feeders

JUKI KE2010 HEAD MAIN PWB ASM E86137290A0 Other juki parts: E86127250A0 OCC LIGHT CIRCUIT BOARD A ASM. E86127290A0 HEAD RELAY PWB ASM. E8612729AA0 HEAD TOP COVER A ASM. E8612729BA0 HEAD RELAY PWB B ASM E8612729CA0 HEAD RELAY PWB C ASM E8613700

ZK Electronic Technology Co., Limited

Technical Library: bga ped connect (5)

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.

ASYMTEK Products | Nordson Electronics Solutions

Strength of Lead-free BGA Spheres in High Speed Loading

Technical Library | 2008-04-08 17:42:27.0

Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.

Nihon Superior Co., Ltd.

Videos: bga ped connect (316)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

SMTA International Exhibition 2015 - Electronics Manufacturing

SMTA International Exhibition 2015 - Electronics Manufacturing

Videos

SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri

Surface Mount Technology Association (SMTA)

Training Courses: bga ped connect (1)

IPC-7711/7721 Rework, Modification and Repair of Electronic Assemblies Training and Certification Program

Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

PIEK International Education Centre

Events Calendar: bga ped connect (3)

SMTA International 2020 Conference & Exhibition

Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA

SMTA International 2020 Conference & Exhibition

Surface Mount Technology Association (SMTA)

NEPCON South China 2018

Events Calendar | Tue Aug 28 00:00:00 EDT 2018 - Thu Aug 30 00:00:00 EDT 2018 | ShenZhen, China

NEPCON South China 2018

Seamark ZM Technology Group Co.,Ltd

Career Center - Jobs: bga ped connect (2)

Sales Manager

Career Center | Garland, Texas USA | Sales/Marketing

Electronics Manufacturing Company is looking for FT/PT full commission sales personnel, 25% and up commission base on value of orders ( not the bottom line). Experience on handling own sales accounts. Extra income for referrals, if you have business

1ST ARTICLE

Manufacturing Specialist (Starlink)

Career Center | Hawthorne, California USA | Production

MANUFACTURING SPECIALIST (STARLINK) Hawthorne, CA, United States SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively develop

SpaceX

Career Center - Resumes: bga ped connect (1)

Debug engineer or bga rework engineer

Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support

tel u later

Express Newsletter: bga ped connect (921)

Reliability of BGA Solder Joints after Re-Balling Process

Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO

SMT Express, Volume 2, Issue No. 2 - from SMTnet.com

(Flex) BGA Using a Polyimide Tape Substrate Trent

Partner Websites: bga ped connect (91)

Thermal Relief for SMD components - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/thermal-relief-for-smd-components_topic1009.html

(?!?), it can certainly make rework difficult with regard to part removal and replacement. Linear Tech encourages the use of solid planes and effectively therefore solder mask defined pads for their BGA and LGA modules

PCB Libraries, Inc.

HELLER 1809MKIII 1913MKIII Board T/C Digitizer Module TDM Heller Insustries

KingFei SMT Tech | http://www.smtspare-parts.com/sale-11658513-heller-1809mkiii-1913mkiii-board-t-c-digitizer-module-tdm-heller-insustries.html

. E86217210A0 BGA BOARD ASM E86217290A0 TEMPERATURE SENSOR PWB ASM. E86227150A0 HEAD SUB UNIT BASE ASM. E86227290A0 LIGHT 2 PWB ASM. E86237000A0 HEAD RELAY CIRCUIT BOARD ASM E86237150A0 HEAD MOTOR CIRCUIT BOARD ASM

KingFei SMT Tech


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