Industry Directory: bga reflow problems (69)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

Dongguan Kingsun Automation Technology CO., Ltd

Dongguan Kingsun Automation Technology CO., Ltd

Industry Directory | Manufacturer

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

New SMT Equipment: bga reflow problems (153)

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

DJ-2200 DispenseJet Non-Contact Flux Jet

DJ-2200 DispenseJet Non-Contact Flux Jet

New Equipment | Dispensing

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi

ASYMTEK Products | Nordson Electronics Solutions

Electronics Forum: bga reflow problems (4084)

bga

Electronics Forum | Mon Sep 06 15:43:25 EDT 1999 | jerrdog

I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". these machines dont even offer bga selections. These machines dont e

Re: bga

Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY

| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac

Used SMT Equipment: bga reflow problems (24)

Yamaha Refurbished YAMAHA YV100XG SMT Pick and Place Machine

Yamaha Refurbished YAMAHA YV100XG SMT Pick and Place Machine

Used SMT Equipment | Pick and Place/Feeders

Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type  L460 * W335 (MAX) -L50 * W50 (MIN)   L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung sm421

Samsung sm421

Used SMT Equipment | Chipshooters / Chip Mounters

      Samsung chip mounter SM-421   Advanced Flexible Mounter   Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Industry News: bga reflow problems (558)

SMT Soldering Equipment Reflow Tool for Industry 4.0 - Frost & Sullivan Award

Industry News | 2017-09-16 02:29:39.0

Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.

Heller Industries Inc.

New EMS, Lightspeed Manufacturing, Opens for Business

Industry News | 2003-03-11 08:16:17.0

Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.

SMTnet

Parts & Supplies: bga reflow problems (18)

Fuji Nozzle for QP/QP132/QP242/QP341

Fuji Nozzle for QP/QP132/QP242/QP341

Parts & Supplies | Chipshooters / Chip Mounters

SMT Nozzle for QP/QP132/QP242/QP341 FUJI QP242 INDEX SMT NOZZLE Part Number (OEM) Description ABHPN - 8510 ABHPN - 8520 ABHPN - 8530 ABHDN - 8560 ABHDN - 8570 ABHPN - 8590 QP-S-12 -ø 0.7 QP-S-12 NZ. ø 1.0 QP-S-12 NZ. ø 1.3 / 1.0 QP-M-38

ZK Electronic Technology Co., Limited

Juki How to choose a second-hand placement machine on SMT?

Juki How to choose a second-hand placement machine on SMT?

Parts & Supplies | Pick and Place/Feeders

Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi

ZK Electronic Technology Co., Limited

Technical Library: bga reflow problems (25)

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Technical Library | 2024-02-02 07:48:31.0

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Lead-Free BGA Rework-Transition Issues

Technical Library | 2007-08-16 13:34:31.0

While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.

BEST Inc.

Videos: bga reflow problems (241)

BGA Reballing and Reflowing

BGA Reballing and Reflowing

Videos

Demo on how to reball a BGA component using a universal reball fixture.

Precision PCB Services, Inc

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Training Courses: bga reflow problems (4)

Guide to Modern Electronics Manufacturing

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

BGA Rework/Profiling Training Course

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Events Calendar: bga reflow problems (9)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Career Center - Jobs: bga reflow problems (45)

Field Service Engineer

Career Center | Florham Park, New Jersey USA | Engineering

Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S

Heller Industries Inc.

SMT Engineer

Career Center | , New Jersey USA | Engineering

Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures

Circuit Search

Career Center - Resumes: bga reflow problems (87)

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Process Engineering/Maintenance Technician

Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control

• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat

Express Newsletter: bga reflow problems (996)

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering

Partner Websites: bga reflow problems (6329)

Reflow Soldering Problems-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23567&url=_print

Reflow Soldering Problems-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Reflow Soldering Problems Reflow Soldering Problems The reflow soldering profile must be matched to the specific requirements of the solder paste as well as the thermal thresholds of the PCB

SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC

| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/

SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes


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