SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 34, (#ts#)) SMT Express, Volume 2, Issue No. 11 - from SMTnet.com Volume 2, Issue No. 11 Friday, November 17, 2000
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
150 m BLT. Fig. 5: CSAM of sTIM Failure Due to Substrate Negative Deflection An upward bow in the substrate will force the sTIM out from the bondline, creating extrusion failures. A properly designed sTIM1 assembly produces an interface with full
