Sub-contract mfg. Low to medium volumes. THD, SMD (BGA, CSP etc.), Complex Rework capability. Fast turn. Consigned, turnkey, mixed.
We are electronic contract manufacture and we also have JIT facility. Our head office located in Markham, Ontario, Canada. We do have a facility in USA, MEXICO and BRAZIL.
Used SMT Equipment | X-Ray Inspection
CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Sold
Used SMT Equipment | Flexible Mounters
144, 8mm feeder capacity, New 2000; 14,400 CPH; Equipped with Hydra with 8 heads Positioning Vision System; Equipped with Midas (Mechanical Centering System); Equipped with Optical Centering System for large fine pitch comp; 2.1.5 (software); 19206
Industry News | 2001-03-20 05:34:19.0
Precision PCB Services announced today that they are now providing BGA Component Rework Training. This course is designed for students that require hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components.
Parts & Supplies | Chipshooters / Chip Mounters
Yamaha nozzle 73A NOZZLE 73A/83A ASSY Product Description Model No.: 73A KV8-M7730-00X material: stainless steel Color: White Origin: JAPAN Packaging: box Productivity: 100000 Brand Name: yamaha Place of Origin: japan Supply Ability: 10
BGA Rework System - Demo showing the machine movements, but not actually soldering a part. http://www.ibesmt.com/SRT-Summit-1100-Rework/Inspection_-_X-Ray/3077/SMT.aspx
ST New and Original M27C2001-10F1 in Stock IC FDIP-32W , 21+ package M27C2001-10F1 2 Mbit (256Kb x 8) UV EPROM and OTP EPROM XC6SLX150-3FGG484C BGA XILINX 20+ XC6SLX100-3FGG484C BGA XILINX 14+ XC6SLX25-2FTG256C BGA XILINX 2
Career Center | , New Jersey USA | Engineering
Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | Fort Worth, Texas USA | Engineering,Maintenance,Production,Quality Control,Research and Development
A mechanically-inclined, results-oriented, lean-driven professional with proven success in implementing programs that result in efficiencies and cost savings. Effectively communicates with diverse audiences, encourages training and employee developme
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