Industry Directory: bga solder ball micro crack (6)

Winslow Automation (aka Six Sigma)

Industry Directory | Consultant / Service Provider

Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.

Assembly Resource

Industry Directory | Manufacturer / Manufacturer's Representative

Sales/Marketing, Manufacturers Representatives, Used Equipment Sales

New SMT Equipment: bga solder ball micro crack (189)

Automatic bga rework machine soldering desoldering station sv-560A bga rework station board repair

Automatic bga rework machine soldering desoldering station sv-560A bga rework station board repair

New Equipment | Rework & Repair Equipment

Automatic bga rework machine soldering desoldering station bga rework station board repair Features: 1. Hot air heater head and mounting head are designed 2 in 1, with auto pick-up,auto solder,auto desolder and auto placement function. 2. Th

Shenzhen Honreal Technology Co.,Ltd

Shultte Star SV-560A Automatic bga rework machine soldering desoldering station bga rework station printed circuit board repair

Shultte Star SV-560A Automatic bga rework machine soldering desoldering station bga rework station printed circuit board repair

New Equipment | Rework & Repair Equipment

Shutte Star SV-560A Automatic bga rework machine soldering desoldering station bga rework station printed circuit board repair Features: 1. Hot air heater head and mounting head are designed 2 in 1, with auto pick-up,auto solder,auto desolder a

Shenzhen Honreal Technology Co.,Ltd

Electronics Forum: bga solder ball micro crack (151)

Solder ball crack

Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef

First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [

BGA ball crack at pad/solder ball interface

Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq

Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach

Used SMT Equipment: bga solder ball micro crack (2)

Yamaha YV100XGP

Yamaha YV100XGP

Used SMT Equipment | Pick and Place/Feeders

Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high

Qinyi Electronics Co.,Ltd

Dage Series 4000 Bondtester

Dage Series 4000 Bondtester

Used SMT Equipment | Semiconductor & Solar

Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull

Fix Trade BV

Industry News: bga solder ball micro crack (78)

MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

Industry News | 2017-04-24 19:04:48.0

This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.

MIRTEC Corp

SMTA China Presents Awards at SMTA China East 2010 Conference/Nepcon China 2010

Industry News | 2010-04-30 18:47:15.0

SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.

Surface Mount Technology Association (SMTA)

Parts & Supplies: bga solder ball micro crack (2)

JOT Optical BGA Rework Station PG-

JOT Optical BGA Rework Station PG-

Parts & Supplies | Repair/Rework

PG-P6860 Main Features: 1、 The top heater can move freely along the X, Y axis in the IR preheating area. It is good for many BGA chips distribution at different positions in the PCB board which need repair. X-shaped infrared laser can do rapid lo

Goodluck Electronic Equipment Co.,Ltd

JOT Optical BGA Rework Station

JOT Optical BGA Rework Station

Parts & Supplies | Repair/Rework

PG-P6800 Main Features: 1、There are 3 independent heaters. The 1st and 2nd hot-air heaters can control multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB boar

Goodluck Electronic Equipment Co.,Ltd

Videos: bga solder ball micro crack (6)

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

Training Courses: bga solder ball micro crack (4)

BGA Rework Training & Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Training & Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: bga solder ball micro crack (1)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Career Center - Resumes: bga solder ball micro crack (4)

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: bga solder ball micro crack (999)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

Partner Websites: bga solder ball micro crack (135)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

:  A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area  Solder crack path typically found at solder joint / BGA package interface  Via in Pad (VIP

Heller Industries Inc.

RW-560A BGA Rewor Station_Shenzhen Honreal Technology CO.,Ltd.

| http://www.szhonreal.com/productview.asp?id=41

± 10mm Forward/backward, ± 10mm left/right PCB locating way   Jig  Placement precision ± 0.01mm Min.pitch of BGA ball 0.15mm Gross power 5600W Bottom IR preheat 3600W Top heater 1200W Bottom heater 800W Max BGA weight 80g Power supply Single phase 220V,50/60Hz, Machine dimension L750*W705*H800mm  Weight Approx. :100kg


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