Industry Directory: bga solder joint fillets (5)

Tianjin Reains Technologies Co., Ltd

Industry Directory | Manufacturer

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.

Vision SMT Kft

Industry Directory | Manufacturer

Vision SMT is professional SMT house.PCBA including BGA,3D AOI inspection, X-ray inspection,selective soldering, in-line coating , testing.

New SMT Equipment: bga solder joint fillets (139)

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

Inspection Services - Visual and X-Ray

Inspection Services - Visual and X-Ray

New Equipment | Inspection

ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for all IPC inspection standards. Visual Inspection Services ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for a

ACI Technologies, Inc.

Electronics Forum: bga solder joint fillets (740)

fillets on fine pitch parts/poor wetting

Electronics Forum | Wed Nov 06 19:03:33 EST 2002 | broncos

If you are certain that reflow process is good, I would suggest starting checking the following: 1. Check to see if leads / pads are contaminated or oxidized. However, this usually results poor solder quality throughout the board. 2. Check the amou

Post reflow solder joint inspection

Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc

About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very

Used SMT Equipment: bga solder joint fillets (6)

CR Tech CRX2000

CR Tech CRX2000

Used SMT Equipment | X-Ray Inspection

CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Sold

1st Place Machinery Inc.

Nicolet NXR-1500

Nicolet NXR-1500

Used SMT Equipment | X-Ray Inspection

Very Nice Nicolet Xray Machine For Sale The system is complete and in good working condition See attached pictures and information below Nicolet Imaging Systems Model Number: NXR-1500 Serial Number: 0150011 Year 2000 Variable Speed Joystick

1st Place Machinery Inc.

Industry News: bga solder joint fillets (247)

CALTRONICS Purchases MIRTEC’s Award-Winning MV-6 OMNI 3D AOI Machine at SMTAI 2016

Industry News | 2016-11-01 19:52:12.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that CALTRONICS Design & Assembly, Inc., a PCB Manufacturing and Electronic Design Company, purchased an award-winning MV-6 OMNI 3D AOI Machine during SMTA International in Rosemont, IL.

MIRTEC Corp

MIRTEC Corp. to Highlight the MV-7L In-Line AOI System at SMTA International 2008

Industry News | 2008-08-11 23:45:48.0

OXFORD, CT � August 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it will display the MV-7L In-Line AOI System in booth 424 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando. FL.

MIRTEC Corp

Parts & Supplies: bga solder joint fillets (1)

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Technical Library: bga solder joint fillets (26)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Surface Finish Issues Affecting Solderability and Reliability

Technical Library | 2019-06-07 14:49:54.0

ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.

ACI Technologies, Inc.

Videos: bga solder joint fillets (32)

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Training Courses: bga solder joint fillets (3)

IPC 7095 BGA Rework Certification

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Events Calendar: bga solder joint fillets (4)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: bga solder joint fillets (1)

SMT Supervisor

Career Center | Williamsport, Pennsylvania USA | Engineering,Management

PRIMUS Technologies Corporation is an electronic manufacturing services (EMS) provider that produces highly reliable products for global government and commercial markets. Our company is an integrated lean enterprise that fully embodies the Six Sigma

PRIMUS Technologies Corp

Career Center - Resumes: bga solder joint fillets (3)

my cv

Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing

AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001

my cv

Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control

AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS

Express Newsletter: bga solder joint fillets (987)

Partner Websites: bga solder joint fillets (372)

Crystal, Side & Heel fillets - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1362&OB=ASC.html

: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5375 Post Options Post Reply Quote Tom H Report Post    Thanks(0)    Quote    Reply Posted: 13 Jun 2014 at 1:30pm Crystals use the same lead form solder joint rules as the Aluminum Electrolytic Capacitor

PCB Libraries, Inc.

Addressing the Issues Around Solder Joint Voids in Surface Mount Components | EPTAC

| https://www.eptac.com/webinar/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components/

Addressing the Issues Around Solder Joint Voids in Surface Mount Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes


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Blackfox IPC Training & Certification

Benchtop Fluid Dispenser
Pillarhouse USA for handload Selective Soldering Needs

High Throughput Reflow Oven
thru hole soldering and selective soldering needs

Training online, at your facility, or at one of our worldwide training centers"
SMT spare parts

500+ original new CF081CR CN081CR FEEDER in stock