Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
► Exclusive 10MP / 18MP Camera Technology ► Precision Telecentric Compound Lens Design ► Eight Phase Color Lighting System ► 10MP / 18MP SIDE-VIEWER® Camera System ► Extremely Simple Programming and Operation ► Integrated INTELLI-BEAM® L
Electronics Forum | Thu Dec 15 06:24:34 EST 2005 | tk380514
whats the pitch of the BGA�s and the stencil thickness?
Electronics Forum | Thu Dec 15 08:20:39 EST 2005 | jhernan9
The BGA pitch is 0.8 mm and stencil thickness is 0.005"
Used SMT Equipment | AOI / Automated Optical Inspection
YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •
Used SMT Equipment | AOI / Automated Optical Inspection
YesTech YTV-F1 Automated PCB Inspection System >Multi-function all purpose In-Line system • (2) Top-down Cameras; Incl. (1) High Magnification • (4) side viewing cameras • LED top light, bi-color multiangle LED lighting •
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Parts & Supplies | Assembly Accessories
Wave soldering machine titanium claw series: There are more than 200 titanium claws such as Rito, Jintuo, Hexi, Duoduo, Chaochao, Honghui, evergreen, Xinhe, teke, Huabang, Hongda, Yifeng, green, Noda, Dongye, Yongxin, imported wave soldering mach
Parts & Supplies | Solder Paste Mixers
Solder paste Mixer Features: Unique contoured shape, generous appearance and practical, which is made by advanced coating process workmanship. Mixing principle is on the basis of Motor rotation and revolution mode of agitation, no need to defrost
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
One unit currently in stock for immediate shipment. Ships from California. The Chip Off Model 620 SMD Rework System features touch screen operation and programming, upper and lower spot hot air heaters, ceramic coated area heaters, HD Split-Vision
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Career Center | , New Jersey USA | Engineering
Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
Career Center | Singapore, Singapore | Engineering,Production
I am a result/goal-oriented engineer with 20 years of experience in Surface Mount Technology (SMT) environment, of which 7 years were heavily involved in field service and field application for Automated Optical Inspection (AOI) machines. I partici
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_component-leads-too-short_topic1789.xml
. Component Leads Too Short : The only option is to hand... Author: Tom HSubject: 1789Posted: 06 Nov 2015 at 10:09amTheonly option is to hand solder the component to ensure a good top fillet.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
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