Industry Directory | Standards Setting / Certification / Training Provider / Consultant / Service Provider / Manufacturer
BEST is a certified master IPC Training and Solder Certification center. We provide comprehensive courses for both Instructors and Operators including IPC-A-610, IPC J-STD-001, IPC-A-600, IPC/WHMA-A-620, and IPC 7711/7721 standard
Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2017-03-31 12:29:11.0
BEST installs and brings Up mass rework machine capability to reduce costs and increase the turnover of boards requiring lots of parts change outs.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2007-02-01 10:08:40.0
The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
Training Courses | ON DEMAND | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Sun May 03 18:30:00 UTC 2020 - Sun May 03 18:30:00 UTC 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Events Calendar | Sat Nov 30 18:30:00 UTC 2024 - Mon Dec 30 18:30:00 UTC 2024 | Lewisville, Texas USA
BGA Rework Station Showroom Open House
Career Center | , New Jersey USA | Engineering
Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures
Career Center | Downers Grove, Illinois USA | Engineering,Production
Opportunities for SMT professionals with experience in: --Generating DFM --Re-Flow Process Knowledge --BGA Placement and Inspection --Generating Pilot Reviews --Create Solder Paste Stencils --Machine Programming
Career Center | Arlington, Texas USA | Engineering,Research and Development
Microelectronics packaging and reliability engineer with three years experience as a post doc. researcher currently conducting several industry oriented projects including: - Development of mechanical bending fatigue test for BGA solder joint evalua
Career Center | , | Engineering,Management,Production,Research and Development
smt, smd, bga, reflow, solder, npi, leadership, electronics assembly, pth
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
Fluxless Soldering Home » Fluxless Soldering Fluxless Soldering Issues from using Flux Traditionally, using flux was a necessary part of soldering
| http://etasmt.com:9060/te_product_g_c646/2020-01-14/10428.chtml
. Control System Computer or Instrument control, make sure machine working steadily. 2. Hot Air Heating System Both top and bottom zones hot air heating,good heater compensatory,High thermal efficiency,energy saving,speedy heating,suitable for soldering components like BGA,CSP
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