Industry Directory | Manufacturer
Qual-Pro is an Electronics Manufacturing Service (EMS) provider. We have built electronics for others since 1971.
Industry Directory | Manufacturer
50K+ sq ft ESD safe plant, O'Hare area,PCB assembly, AeroSpace AS9100, Medical ISO 13485 and ISO 9001 certified, 01005, 0201, uBGA, PoP, QFN, DFN, CSP, QFP, TQFP placements. State-of-the-art equipment. Aluminum PCBA, Large Boards
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
http://www.flason-smt.com/product/Samsung-SM481-Pick-and-Place-Machine.html Samsung SM481 Pick and Place Machine Samsung SM481 Pick and Place Machine Chip theoretical speed 39,000CPH 1650 X 1680 X 1530MM weight 1655KG Product description: Sam
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100 Ⅱ YAMAHA multi-functional SMT machine Product number: YV100 Ⅱ Products in detail YAMAHA multi-function placement machine YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000 (grain per
Used SMT Equipment | SMT Equipment
Product name: YV100 Ⅱ YAMAHA multi-functional SMT machine Product number: YV100 Ⅱ Products in detail YAMAHA multi-function placement machine YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000 (grain per
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-06-25 12:40:26.0
to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks
Technical Library | 2015-08-20 15:18:38.0
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices. Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Precision PCB Services, Inc. to Exhibit at the SMTA’s Space Coast Expo & Tech Forum, which will take place on November 14th, at the Melbourne Auditorium, 625 E. Hibiscus Blvd., Melbourne, Florida. Precision PCB Services, Inc. will be providing infor
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ON DEMAND | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Nov 13 18:30:00 UTC 2024 - Wed Nov 13 18:30:00 UTC 2024 | Melbourne, Florida USA
SMTA Space Coast Expo & Tech Forum
Events Calendar | Wed Mar 17 18:30:00 UTC 2021 - Wed Mar 17 18:30:00 UTC 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Career Center | New Delhi, India | Engineering,Research and Development
I have 2 Years experience in SMT,THT and BGA components and 3+ years experience in total. Currently,working in a CMMi LEVEL 5 enviornment. I have been Working on various Panasonic series machines and fuji components. My work profile involves : 1. Si
Career Center | New Delhi, India | Engineering,Research and Development,Technical Support
I have 2 Years experience in SMT,THT and BGA components and 3+ years experience in total. Currently,working in a CMMi LEVEL 5 enviornment. I have been Working on various Panasonic series machines and fuji components. My work profile involves : 1. Si
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=17
. Products Content Your results for: High Strain Rate Testing Coatings v4 Nordson DAGE Terms and Conditions of Sale Nordson DAGE Non-Destructive Techniques for Identifying Defect in BGA Joints
| http://etasmt.com/cc?ID=te_news_bulletin,18761&url=_print
. Set according to the material, thickness, multi-layer board and size of the PCB board. 6. Set according to the density of surface mount board components, the size of components, and special components such as BGA and CSP
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