Industry Directory: bga spacing (18)

Titan PCB

Industry Directory |

High Tech, Quick Turn, Manufacturer of PCB's up to 44 layer count. Specializing in Prototype and R&D. Mil-Spec 31032 & 55110 Certified. Located in Fremont, CA & Amesbury, MA.

Qual-Pro Corporation

Industry Directory | Manufacturer

Qual-Pro is an Electronics Manufacturing Service (EMS) provider. We have built electronics for others since 1971.

New SMT Equipment: bga spacing (57)

QWIKTRAY Custom Matrix Trays for Electronic Components

QWIKTRAY Custom Matrix Trays for Electronic Components

New Equipment | Pick & Place

Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of

Count On Tools, Inc.

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

Electronics Forum: bga spacing (113)

Question on BGA Solderability

Electronics Forum | Tue Jul 24 13:15:22 EDT 2001 | Steve Schrader

Greg, The increased space and hence potentially increased airflow will have no effect on "solderability." It may effect the temperature that the balls see and that is a different issue that can be worked from a profile standpoint if you are not hit

BGA underfilling

Electronics Forum | Mon Nov 12 16:13:48 EST 2001 | davef

Underfill is primarily used in flip chip, CSP attach applications. It is used to balance the differing thermal expansion rates for an organic board, solder, and silicon die. There are a fair number of papers written on this in the SMTA [www.smta.or

Used SMT Equipment: bga spacing (6)

Yamaha YV100 Ⅱ multi-functional SMT machine

Yamaha YV100 Ⅱ multi-functional SMT machine

Used SMT Equipment | Chipshooters / Chip Mounters

Product name: YV100 Ⅱ YAMAHA multi-functional SMT machine Product number: YV100 Ⅱ Products in detail YAMAHA multi-function placement machine YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000 (grain per

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha original YV100 Ⅱ YAMAHA multi-functional SMT machine

Yamaha original YV100 Ⅱ YAMAHA multi-functional SMT machine

Used SMT Equipment | SMT Equipment

Product name: YV100 Ⅱ YAMAHA multi-functional SMT machine Product number: YV100 Ⅱ Products in detail YAMAHA multi-function placement machine YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000 (grain per

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: bga spacing (105)

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Circuit World Announces License of Channel Routing Technology from Nortel Networks

Industry News | 2003-06-25 12:40:26.0

to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks

SMTnet

Parts & Supplies: bga spacing (2)

Yamaha YV 100II

Yamaha YV 100II

Parts & Supplies | Pick and Place/Feeders

Yamah YV100 II parameter 1. Highways based on the reliability of basic structures 2. Paste of protective elements 3.0.25 seconds / CHIP high-speed mount 4. Can mount 0.5 foot spacing 32mm QFP 5. High Speed Image Processing 6.2 cameras reduced p

KingFei SMT Tech

Samsung SM481 Chip Mounter

Samsung SM481 Chip Mounter

Parts & Supplies | Chipshooters / Chip Mounters

Samsung SM481 Chip Mounter Focus on the way flight vision + fixed vision (optional) Number of axes 10 axes * 1 gantry Mounting Speed 0603 39000 (Best Conditions) Mounting accuracy chip ± 50um @ 3ó / chip, QFP ± 30um @ 3ó / chip Component Ra

ZK Electronic Technology Co., Limited

Technical Library: bga spacing (3)

Assembly and Reliability of 1704 I/O FCBGA and FPBGAs

Technical Library | 2013-03-14 17:19:28.0

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.

Jet Propulsion Laboratory

Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly

Technical Library | 2015-08-20 15:18:38.0

Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices. Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results.

Celestica Corporation

Videos: bga spacing (13)

Shuttle Star SV560A Demo - Removing the $50K Xilinx XCVU190 BGA

Shuttle Star SV560A Demo - Removing the $50K Xilinx XCVU190 BGA

Videos

Precision PCB Services, Inc. to Exhibit at the SMTA’s Space Coast Expo & Tech Forum, which will take place on October 7, Melbourne Auditorium, 625 E. Hibiscus Blvd., Melbourne, Florida Precision PCB Services, Inc. will be providi

Precision PCB Services, Inc

SMT conveyor,PCB linking conveyor,PCB conveyor

SMT conveyor,PCB linking conveyor,PCB conveyor

Videos

https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava

ASCEN Technology

Training Courses: bga spacing (1)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: bga spacing (3)

SMTA Space Coast Expo & Tech Forum

Events Calendar | Thu Nov 14 00:00:00 EST 2024 - Thu Nov 14 00:00:00 EST 2024 | Melbourne, Florida USA

SMTA Space Coast Expo & Tech Forum

Precision PCB Services, Inc

Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects

Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,

Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects

Surface Mount Technology Association (SMTA)

Career Center - Jobs: bga spacing (4)

Advanced Manufacturing Technology Engineer

Career Center | Space Coast, Florida USA | Engineering,Research and Development

Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit

Priority Search

Senior Advanced Packaging Engineer

Career Center | Melbourne, Florida USA | Engineering

Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi

Harris Corporation

Career Center - Resumes: bga spacing (4)

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

Express Newsletter: bga spacing (550)

Partner Websites: bga spacing (91)

High Strain Rate | Nordson DAGE

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=17

. Products Content Your results for: High Strain Rate Testing Coatings v4 Nordson DAGE Terms and Conditions of Sale Nordson DAGE Non-Destructive Techniques for Identifying Defect in BGA Joints

ASYMTEK Products | Nordson Electronics Solutions

Reflow Soldering Oven Temperature Curve Setting Basis-News-Reflow oven,SMT Reflow Soldering Oven-cms

| http://etasmt.com/cc?ID=te_news_bulletin,18761&url=_print

. Set according to the material, thickness, multi-layer board and size of the PCB board.   6. Set according to the density of surface mount board components, the size of components, and special components such as BGA and CSP


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