Industry Directory: bga square pad (27)

InnerStep

Industry Directory | Manufacturer

pcb construction@testing using surface mount and through hole components.

USA STENCILS , INC.

Industry Directory | Consultant / Service Provider / Manufacturer

Manufacturing SMT Stencil, Reballing stencil. SMT pallet; Wave solder pallet and Engineering Services

New SMT Equipment: bga square pad (35)

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

BGA Rework Services Offered  BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

PCB Rework, PCB Repair Services

PCB Rework, PCB Repair Services

New Equipment | Rework & Repair Services

On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and  product  research and developers.  Specializing in quick turn around times to help get your product to market on time. Training Serv

Precision PCB Services, Inc

Electronics Forum: bga square pad (1269)

square pads

Electronics Forum | Wed Mar 03 11:30:18 EST 1999 | dave reese

Are square pads more difficult to wavesolder than round pads? I am referring to a through hole board.

Re: square pads

Electronics Forum | Thu Mar 04 12:49:49 EST 1999 | SMTASSY

| Are square pads more difficult to wavesolder than round pads? | I am referring to a through hole board. | Usualy square pads are for indication of pin 1 on a DIP for example. There might be a difference in the capilary affect due to a different su

Used SMT Equipment: bga square pad (36)

Juki original KE - 3010 A high-speed chip mounter

Juki original KE - 3010 A high-speed chip mounter

Used SMT Equipment | SMT Equipment

Product name: KE - 3010 A high-speed chip mounter Product number: KE – 3010A Detailed product introduction Characteristic: Constantly improve the KE series products. So as to realize the high speed high quality electric production line of flexib

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung multi-function SM421 chip mounter

Samsung multi-function SM421 chip mounter

Used SMT Equipment | Flexible Mounters

Product Name: Samsung multi-function SM421 chip mounter Product number: SM421 Detailed product introduction Samsung multi function SM421 chip mounter Mounting speed: 21K CPH /QFP (IPC9850) 5.5K CPH Chip (IPC9850) The corresponding components: Ma

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: bga square pad (146)

Stencils Optimise Paste Release

Industry News | 2003-03-21 08:12:24.0

Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.

SMTnet

Precision PCB Services, Inc. Opens New Office in Plano, Texas

Industry News | 2023-08-03 11:31:37.0

PCB/BGA Rework and Training Facility now in Plano, Texas

Precision PCB Services, Inc

Parts & Supplies: bga square pad (261)

Juki SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0

Juki SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0

Parts & Supplies | SMT Equipment

SMT Pick And Place Equipment Parts JUKI 730 740 750 760 1700 1710 IMG-P IMAGE BOARD E86107210A0 Specifications: Brand Name JUKI IMG-P IMAGE BOARD Part number E86107210A0 Model IMG-P Ensure Test in machine confirmation Guarantee 3 month u

KingFei SMT Tech

Fuji QP341 SMT Machine FUJI Nozzle 3.7m ADBPN-8143 In Pick And Place Machine

Fuji QP341 SMT Machine FUJI Nozzle 3.7m ADBPN-8143 In Pick And Place Machine

Parts & Supplies | Pick and Place/Feeders

QP341 SMT Machine FUJI Nozzle 3.7m ADBPN-8143 In Pick And Place Machine Description: Model: ADBPN-8143 Description: 3.7mm Used in FUJI QP341 Machine supply All FUJI Machine model Spare Parts, Original new inventory quantities,Original used an

KingFei SMT Tech

Technical Library: bga square pad (14)

Pad Cratering

Technical Library | 2020-05-08 18:22:31.0

A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.

ACI Technologies, Inc.

New BGA Solder Mask Repair Technique Using Laser Cut Stencils

Technical Library | 2007-02-01 10:08:40.0

The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.

BEST Inc.

Videos: bga square pad (38)

PCB Footprint Expert

PCB Footprint Expert

Videos

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

BGA Rework Stations - How to Evaluate

BGA Rework Stations - How to Evaluate

Videos

Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/

Precision PCB Services, Inc

Training Courses: bga square pad (12)

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Reballing Seminar

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: bga square pad (2)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: bga square pad (1)

Packaging Engineer

Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support

SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic

Texas Instruments

Career Center - Resumes: bga square pad (7)

PCB Layout Designer

Career Center | Coimbatore, Tennessee India | 2017-06-05 07:55:08.0

Engineering

Process Engineer

Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support

SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.

Express Newsletter: bga square pad (573)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part

Partner Websites: bga square pad (2056)

BGA Pad Repair – Precision PCB Services, Inc.

Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-pad-repair

BGA Pad Repair – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc

Precision PCB Services, Inc

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling

Heller Industries Inc.


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