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ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.
Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef
Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during
Industry News | 2025-08-04 14:01:05.0
PEMTRON, an inspection equipment developer and supplier, will showcase its latest breakthroughs in semiconductor and electronics inspection in Booth L406 at the KPCA Show 2025 (International Electronic Circuits and Packaging Show), held September 3-5, 2025 at Songdo Convensia in Incheon, Korea.
Industry News | 2006-11-08 12:41:46.0
Workshop Scheduled for January 24 in Silicon Valley
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
This is a stack up of BGA types of packages New Section 8.3.15 Flattened Post Connections, Round Solder Land Criteria for Class 3 has not been established for this device, so only requirements are for Class 1 and 2 17 Highlights of 001 Changes
