Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef
Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during
Industry News | 2006-11-08 12:41:46.0
Workshop Scheduled for January 24 in Silicon Valley
Industry News | 2010-01-05 14:01:30.0
MADISON, AL — January 2010 — STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will feature its key products and services at the upcoming Pan Pacific Microelectronics Symposium & Tabletop Exhibition, scheduled to take place January 26-28, 2010 at the Sheraton Kauai Resort on Kauai, Hawaii.
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
This is a stack up of BGA types of packages New Section 8.3.15 Flattened Post Connections, Round Solder Land Criteria for Class 3 has not been established for this device, so only requirements are for Class 1 and 2 17 Highlights of 001 Changes
