New Equipment | Assembly Services
Thick-Copper PCB Material: Fr-4 Layer Count: 4 layers PCB Thickness: 1.4mm Min. Trace / Space Outer: 0.065mm Min. Drilled Hole: 0.2mm Via Process: Tenting Vias Surface Finish: ENIG Product Features Features: 1) Years of experience in half-
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Fri Dec 17 14:30:42 EST 2004 | Dreamsniper
I goy this issue: Voids in almost every ball of my BGA's prcessed since we changed our BGA via tenting to double tenting. The tenting is done with a dry film application to fill the via from the solder side then apply LPI Mask on the surface of the
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
This is a stack up of BGA types of packages New Section 8.3.15 Flattened Post Connections, Round Solder Land Criteria for Class 3 has not been established for this device, so only requirements are for Class 1 and 2 17 Highlights of 001 Changes
