Industry Directory: bga under a can (115)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

ScanCAD International, Inc.

ScanCAD International, Inc.

Industry Directory | Other / Consultant / Service Provider / Manufacturer

ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.

New SMT Equipment: bga under a can (6274)

Selective Conformal Coating Systems - Tilt and Rotate

Selective Conformal Coating Systems - Tilt and Rotate

New Equipment | Coating Equipment

Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000.  SimpleCoat basic model without tilt and rotate

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

Used SMT Equipment: bga under a can (223)

Yamaha original YV100XGP YAMAHA  chip mounter at a moderate speed

Yamaha original YV100XGP YAMAHA chip mounter at a moderate speed

Used SMT Equipment | SMT Equipment

Product name: YV100XGP YAMAHA  chip mounter at a moderate speed Product number: YV100XGP Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XGP High speed and high precision multi-function modular placement machine 0.18 seconds/

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100XGP chip mounter at a moderate speed

Yamaha YV100XGP chip mounter at a moderate speed

Used SMT Equipment | SMT Equipment

Product name: YV100XGP YAMAHA  chip mounter at a moderate speed Product number: YV100XGP Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XGP High speed and high precision multi-function modular placement machine 0.18 seconds/

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: bga under a can (1805)

Conformal Coating System For Under $40,000!!!

Industry News | 2017-11-07 23:20:25.0

GPD Global offers a cost-effective, automated Conformal Coating System (SimpleCoat) with excellent repeatability for just under $40,000!!!

GPD Global

Conformal Coating & Latest Dispense Technology at SMTAI

Industry News | 2018-10-08 20:18:03.0

GPD Global will exhibit at the upcoming SMTA International 2018. At booth# 517, see our automated Conformal Coating Machine with excellent repeatability for under $40,000.

GPD Global

Parts & Supplies: bga under a can (600)

Technical Library: bga under a can (62)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.

ASYMTEK Products | Nordson Electronics Solutions

Videos: bga under a can (881)

Cost Effective Solution for Conformal Coating

Cost Effective Solution for Conformal Coating

Videos

Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000.  SimpleCoat basic model without tilt and rotate

GPD Global

Watch this conformal coating demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system.

Watch this conformal coating demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system.

Videos

http://www.gpd-global.com Conformal coating (SimpleCoat) demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system. The Spray Valve sprays HumiSeal 1B31 from a height of approximately 20 mm above the board. The Volumetr

GPD Global

Training Courses: bga under a can (30)

IPC-7711/7721 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

Blackfox Training Institute, LLC

IPC-7711/7721 Expert (CSE) Certification Training Course

Training Courses | | | IPC-7711/IPC-7721 Expert (CSE)

The IPC-7711/IPC-7721 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-7711/IPC-7721 standard.

Blackfox Training Institute, LLC

Events Calendar: bga under a can (12)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Sun Mar 15 18:30:00 UTC 2020 - Sun Mar 15 18:30:00 UTC 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Ball Grid Array Rework - How to Do It Successfully

Events Calendar | Sun May 03 18:30:00 UTC 2020 - Sun May 03 18:30:00 UTC 2020 | ,

Ball Grid Array Rework - How to Do It Successfully

Surface Mount Technology Association (SMTA)

Career Center - Jobs: bga under a can (16)

Manufacturers Representative

Career Center | Burnet, Texas USA | Sales/Marketing

Austin American Technology is seeking Independent Manufacturers Representation for our Arizona and New Mexico territory. AAT is looking for a representative organization with complementary lines of capital equipment that would like to add the world

Austin American Technology

Manufacturers Representative

Career Center | Burnet, Georgia, Mississippi, Tennesse, Kentucky | Sales/Marketing

Austin American Technology is seeking Independent Manufacturers Representation for our Arizona and New Mexico territory. AAT is looking for a representative organization with complementary lines of capital equipment that would like to add the world

Austin American Technology

Career Center - Resumes: bga under a can (15)

Curriculum Vitae of Mr. Marlon U. Arce

Career Center | Al-Nahda, Sharjah United Arab Emirates | Engineering,Production,Quality Control,Sales/Marketing,Technical Support

� Sales Representative � Warehouse Employee � Line Leaders� Supervisor � Inventory Controller�s Assistant � Delivery Supervisor cum Logistic Officer � Chemical Preparatory � Customer Service Representative � Lead Crew � Station Loader � Factory Worke

SMT Production Engineer

Career Center | 10th of ramadan, Egypt | Engineering,Maintenance,Management,Production

• Excellent Analytical, inter-personal and communication skills                 • Ability to work effectively in teamwork • Ability to set and achieve goals and work under pressure • Learn quickly, hard worker • Capable of study and research acti

Express Newsletter: bga under a can (1325)

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Partner Websites: bga under a can (3200)

Material management under control

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/material-management-under-control

. Large DIP devices in tubes and P TH resistors were relatively easy to count but the move to reel mounted devices where you can have tens of thousands on a reel makes counting by eye impossible

ASYMTEK Products | Nordson Electronics Solutions

591823 - Manual Hard Copy, 1900 (Oven under warranty)

Heller Industries Inc. | https://hellerindustries.com/parts/591823/

& don't have a lot of time. We can do a consult over Webex and you can ask your reflow oven / reflow soldering questions without having to listen to a sales pitch

Heller Industries Inc.


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