Industry Directory | Manufacturer
We specialize in Flex PCBs, Ridgid Flex, Long Flex PCBs and RF (radio frequency) Boards. Our engineering team has seen it all.
Industry Directory | Manufacturer
PCBCart, a highly skilled PCB Fab, Parts Sourcing & Assembly services provider for global companies, fabricates 23k+ different PCB designs each year, and are committed on the quality & performance of every circuit board it printed
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
New Equipment | Assembly Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board
Electronics Forum | Wed Mar 14 13:16:54 EDT 2007 | Shane
I have a customer that designed a fine pitch BGA into a board, and has put small vias in the middle of each pad on the PCB. Anyone have any ideas on how I can prevent the solder from the BGA from flowing through the vias and causing voids or no cont
Electronics Forum | Fri Mar 23 09:13:48 EDT 2007 | Peter W
Hello, those plated and solderable via in pads have two critical points: 1. We have discovered that _sometimes_ the plating seems not to be perfect, as extreme voiding is visible in tha bga solder ball 2. The detection of some defects by AXI is limi
Parts & Supplies | Pick and Place/Feeders
Smt Fuji QP341 nozzles 6.0x0.3mm nozzle used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00 Nozz
Parts & Supplies | SMT Equipment
Smt Fuji XP141 nozzles 1.0 nozzle ADEPN-8080 used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Pad Cratering - The Invisible Threat to the Electronics Industry SMTnet Express September 6, 2012, Subscribers: 25455, Members: Companies: 8972, Users: 33613 Pad Cratering - The Invisible Threat to the Electronics Industry First published
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-pad-repair
BGA Pad Repair – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/via-high-volume-series
. The VIA series plasma treatment systems utilize a patented plasma technology to produce superior uniformity at high throughputs. The VIA series for large-panel plasma processing is available in various chamber sizes, with choice of vertical or horizontal panel configurations
