Industry Directory | Manufacturer
Specialized in QTA complex multilayer printed circuit boards. Technology includes fine pitch SMT & BGA, micro vias, 2 to 28 layer multilayers, high speed laminate packages.
Engineering Services Company, Electronic Engineering, Software, Embedded Systems,Prototypes, Production Supply Chain Management.
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printing
Used SMT Equipment | X-Ray Inspection
Configuration Complete X·ray Protection Cabinet With Safety Interlocks 160 Kv Microfocus Demountable Open X-ray Tube Transmission Target (-500 Nanometer Resolution} True X-ray Intensity (Txi) Control 10 Watts Target Power Qty.6 -
Used SMT Equipment | In-Circuit Testers
SPEA 4040 Flying Probe with Boundry Scan Model: FP 4040 HI-LINE SERIES 5 Flying Probe Tester Year: 2004 S/N: SWE537FF 4040 Hi Line; high speed high accuracy (1) DRIV-10 V/I Generator; Precision Driver, 4Q, +/-10V, +/- 1A (1) Boost-80 V/I Gene
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Career Center | San Jose, California USA | Engineering,Management,Research and Development
Ph.D., MBA, senior technical & management experience, advanced technology, electronics manufacturing processes, packaging, miniaturization, reliability, global team, PWB assembly, soldering Experience: 2001 - Flextronics, San Jose, CA Senior Manage
Career Center | San Jose, California USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
7044 Elmsdale Drive, San Jose, CA 95120 Phone: (408) 323 8971 E-Mail: DShangguan@Yahoo.Com Key Words: Ph.D., MBA, technical & management experience, advanced technology, electronics manufacturing processes, packaging, miniaturization, reliability, g
SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass
SMTnet Express, March 3, 2016, Subscribers: 24,124, Companies: 15,000, Users: 40,059 Nanocopper Based Paste for Solid Copper Via Fill David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody; Intrinsiq Materials , Sunny Patel; Candor
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-pcb-advantages-and-applications/
(High Density Interconnect) technology is increasingly becoming the solution for smaller, more durable, and more efficient PCBs. HDI technology allows for lighter, smaller products that do more faster than ever before by leveraging blind and buried vias that can be staggered, stacked, and integrated with microvias
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