Industry Directory: bga vias plugged tent (1)

New SMT Equipment: bga vias plugged tent (6)

8 layers PCB with blind buried vias

8 layers PCB with blind buried vias

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads

CYZON LIMITED

ERSA Mobile Scope - BGA Inspection System

ERSA Mobile Scope - BGA Inspection System

New Equipment | Inspection

ERSA mobile scope - camera units with lenses and desk-top holder ERSA mobile scope - solder joint inspection in the twinkling of an eye The ERSA mobile scope is a compact and handy, portable video microscope to inspect solder joints in electronic

kurtz ersa Corporation

Electronics Forum: bga vias plugged tent (100)

Via tent on both side of the PCB; Immersion Tin

Electronics Forum | Sat Oct 06 08:27:24 EDT 2001 | davef

Yes, some solder masks do not tent well, because the material is too thin. That�s the trade-off. Thin masks: * Conform well to [don't bleed onto] fine pitch features. * Tent vias poorly, requiring an additional "plugging" step. As you imply, if th

Using LPI w/ tented vias

Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy

I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via

Industry News: bga vias plugged tent (21)

Via Tent-Holes with Solder Mask

Industry News | 2018-10-18 10:40:04.0

Via Tent-Holes with Solder Mask

Flason Electronic Co.,limited

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2014 in Las Vegas

Industry News | 2013-09-26 18:03:10.0

IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.

Association Connecting Electronics Industries (IPC)

Videos: bga vias plugged tent (2)

BGA Rework with ATCO model AT-707 BGA Rework Station

BGA Rework with ATCO model AT-707 BGA Rework Station

Videos

Demonstrates installation of a BGA component using the AT-707 BGA Rework Station. Features include split vision optics, software process control, and lead free reflow capable.

Advanced Techniques US Inc. (ATCO)

Fine Pitch QFP 208 Rework

Fine Pitch QFP 208 Rework

Videos

Demonstrates desoldering, solder paste printing, and installation of a fine pitch QFP 208 (30.6mm x 30.6mm) component using an ATCO model AT-GDP Placement & Rework Station.

Advanced Techniques US Inc. (ATCO)

Express Newsletter: bga vias plugged tent (537)


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