Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide. Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref
Electronics Forum | Wed Jan 20 13:07:16 EST 1999 | Robert Noory
I have received prototype PBGA (256 pins) devices from Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I have
Electronics Forum | Wed Jan 13 19:13:59 EST 1999 | Michael Allen
Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype" line at our component supplier's lab (non-production overmold material was used). Production parts have not exhibite
Used SMT Equipment | Pick and Place/Feeders
Type Pick and Place machineDimension off-line (L x W x H) 2150 x 1700 x 1500 mm (+500 mm for signal light)Dimension in-line (L x W x H) 1750 x 1300 x 1500 mm (+500 mm for signal light)Board thickness min. 0.5 mm - max. 4.5 mm thickBoard size min. 30
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2019-04-11 05:59:57.0
Are your MSD safely stored? As humidity is found to be one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase their production efficiency and save the cost. In the industries of semi-conductor and electronics, the key section in which the rejected products are most probably to be made is that during the heating process of SMT, the IC(e.g.,PBGA,BGA,or TQFD) is likely to crack and thus cause non-effective welding because of the humidity. Climatest Symor® auto dry cabinet is the best solution to avoid the cracking and non#2;effective welding by dehumidifying the surface of your components. The dry unit can be used for 20 years without replacement,and controller is calibration free within 5 years.We attach dry cabinet application with different humidity range,welcome to download.
Technical Library | 2017-07-06 15:50:17.0
Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
@smta.org Advanced Packaging/Components: 2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
) and BGA ball and solder paste alloy differences. During reflow, board/component warpage, poor wetting and co-planarity issues can also create this
