Industry Directory | Manufacturer
Full service supplier of silicon wafers and wafer processing services, including polishing, reclaim, thermal oxide and back-grinding. Supplies silicon wafers in all specifications from 2in. to 300mm in diameter.
Montco has a large inventory of silicon substrates 2" to 300mm
New Equipment | Coating Equipment
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
Electronics Forum | Thu Jul 31 15:41:23 EDT 2003 | davef
Q: Could any of you guys tell me what exactly is this greenish thing ? A: No, but is not copper oxide. Copper oxide is brown, the color of a penny [here in the US] or an untreated copper laminated trace on a board. Many copper salts are greenish in
Electronics Forum | Thu Jul 31 11:33:51 EDT 2003 | yngwie
I faced problem over connecter's pin that were hot air soldered. This connector has 168 pins ( similar to the straddle connector ). The process is to apply the flux onto the connector's J-leads, and the hot air pencil were then ran thru' the leads to
Used SMT Equipment | Soldering - Selective
Details: • Lead and Lead Free Pots • Inerted Nitrogen System • Drop Jet Fluxer • Internal Fume Extraction • Black & White Programming Camera • Manual Solder Level Top-up • Auto Solder Wire Feeder •
Used SMT Equipment | Soldering Equipment/Fluxes
The MWM 3250 is a modular selective SOLDERING system which may be totally tailored to meet your production requirements. It means: *maximum flexibility with: - different working stations, as for instance fluxer units, solder units, preheat units, t
Industry News | 2017-11-07 23:20:25.0
GPD Global offers a cost-effective, automated Conformal Coating System (SimpleCoat) with excellent repeatability for just under $40,000!!!
Industry News | 2003-03-17 09:40:03.0
Omnimate BLZ/BLZF 5.08F PCB connectors have integral screwed flanges to ensure safe and secure connection under the most severe vibration conditions.
Parts & Supplies | SMT Equipment
MPA G3 Model: PANASERT MPA G3 Nozzle PANASERT Nozzle List Brand Machine Model Specification Material of nozzle tip PANASERT MV "O"hole Nozzle 1.0 / 1.2 / 1.6 / 3.0 Tungsten steel PANASERT MV No.1 Nozzle 0402X / 0603X / 0805王 Tungsten steel
Parts & Supplies | SMT Equipment
MPA small Model: PANASERT MPA Small Nozzle PANASERT Nozzle List Brand Machine Model Specification Material of nozzle tip PANASERT MV "O"hole Nozzle 1.0 / 1.2 / 1.6 / 3.0 Tungsten steel PANASERT MV No.1 Nozzle 0402X / 0603X / 0805王 Tungsten s
Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
http://www.gpd-global.com Conformal coating (SimpleCoat) demonstration of the Spray Valve and Volumetric Pump in action on the SimpleCoat system. The Spray Valve sprays HumiSeal 1B31 from a height of approximately 20 mm above the board. The Volumetr
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Juarez Chapter Webinar: DFM, Design For Manufacturing
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)
Career Center | Corpus Christi, Texas USA | Engineering,Production
Improve and expand capabilities related to thin film sputtering/CVD deposition as required by Operations and the Business Unit. This position reports directly to the Engineering Manager. Responsibilities: Continuous improvement of sputtered th
Career Center | Waterloo, Ontario Canada | Research and Development
POSITION SUMMARY Reporting into the SMT Process Engineering organization, the successful candidate will be aligned with specific new product introductions and will play a pivotal technical role in the design for manufacturability of these products.
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/
What is the PCB Fabrication Process? | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
| https://www.smtfactory.com/Introduction-of-Lyra-Reflow-Oven-s-process-development-stage-id3093448.html
Introduction of Lyra Reflow Oven's process development stage. - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
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