Industry Directory | Consultant / Service Provider
PWB America, Inc. is a complete solution for prototype PCB layout design, fabrication and assembly. Providing quick turn
New Equipment | Assembly Services
BEST can provide you with analysis services for your BGAs using x-ray equipment. We rework thousands of BGAs and POPs every year, therefore, we have the expertise in BGA X-ray inspection. BEST can be your outsourced BGA x-ray inspection source for o
http://www.flason-smt.com/product/Automated-Optical-Inspection-Machine.html Automated Optical Inspection Machine ZW 625 Dimension:900*1100*1350 mm Max PCB:430x330mm Inspection Component: 0201 chip Weight:Aprox. 450kg Product description: Auto
Used SMT Equipment | Pick and Place/Feeders
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Used SMT Equipment | In-Circuit Testers
Agilent 89431A RF Section The 89431A RF Section is designed to couple with an Agilent 89410A Vector Signal Analyzer (VSA) to extend the coverage from 10 MHz to 2.65 GHz. When an Agilent 89410A VSA and an 89431A RF Section are combined, it
Industry News | 2003-02-07 08:34:04.0
Featuring Individual Instructors who, for Approximately 90 Minutes Each, will Speak on a Timely and Specific Topic
Industry News | 2003-03-14 08:18:03.0
The instruction is intended as a practical user's guide for determining if a failure is related to black pad.
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Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
SMT On-line 3D Solder Paste Inspection If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Mar 17 18:30:00 UTC 2021 - Wed Mar 17 18:30:00 UTC 2021 | ,
Silicon Valley Chapter Webinar: Electronics Reliability for Autonomous Vehicles
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Waterloo, Ontario Canada | Research and Development
POSITION SUMMARY Reporting into the SMT Process Engineering organization, the successful candidate will be aligned with specific new product introductions and will play a pivotal technical role in the design for manufacturability of these products.
Career Center | Waterloo, Ontario Canada | Engineering,Research and Development
**To apply please send your resume to clapierre@rim.com** Research In Motion Limited� (RIM)� is a world leader in the mobile communications market and has a history of developing breakthrough wireless solutions. RIM's portfolio of award-winning prod
Career Center | Norfolk, Virginia USA | Engineering,Maintenance,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support
Jay Selter Test Engineer / Technician; Formal Education: Schools and Courses completed. BROOKLYN TECHNICAL HIGH SCHOOL, NEW YORK: Electrical engineering design (two year major): Meter design and construction; Transformer design and materials; Moto
Career Center | , Tirane | Engineering
Process Engineer, Co-Op, R&D (May 2010 to Present) Speedline Technologies, Inc. Franklin MA, United States Research and conduct in-depth analysis for Stencil Printing machines (MPM) manufactured by Speedline Technologies, Inc. for operations i
ORION Industries | http://orionindustries.com/pdfs/qpad2.pdf
Grease Replacement Materials without Electrical Isolation Physical Properties Q-PAD II Q-PAD 3 Test Method Color Black Black Visual Thickness Inches .006/.0065 w/ac ±.001.005/.0055 (w/ac) ASTM D374 (mm) .152 ±.025 (.15
KingFei SMT Tech | https://www.smtspare-parts.com/sale-14324537-mc14-000068-pad-vacuum-pfg-3-5a-rubber-pad-samsung-sm-nozzle.html
MC14-000068 Pad Vacuum -PFG-3.5A Rubber Pad Samsung Sm Nozzle Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
