Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
Electronics Forum | Tue Feb 11 15:54:23 EST 2003 | Jodi Roepsch
I am interested in knowing if anyone has new information about the black pad defect with ENIG plating. I am interested in it from the viewpoint of risk assessment, testing done on final product to isolate failures,and root cause of the defect. Than
Electronics Forum | Tue Mar 11 08:33:31 EST 2003 | davef
SMTA [www.smta.org] New On-line Presentation - March 14 Dealing with the Black Pad Defect in Manufacturing Solectron Vice President of Technology Srinivas Rao And Director of Process Integration Kim Hyland Date: Friday, March 14 Time: 10:30AM - Noon
Used SMT Equipment | Pick and Place/Feeders
PEMTRON SPI TROI-7700HD Technology & Features: Dual Projection Combination of 2D & 3D inspection eliminates common shadow problem with SPI systems. 64 bit Windows 7 Operation System Fast & Stable Operating System for high density PCB.
Used SMT Equipment | Repair/Rework
Warranty: 90 days parts & labor against manufacturing defects - wear items not included 1IR550A000A67 1 PC IR550A Infrared Rework System - 115V/US 1600 W heating power -800 W bottom side - 135 x 260 mm -800 W top side - 60 x 60 mm 1 K-type themoco
Industry News | 2003-02-07 08:34:04.0
Featuring Individual Instructors who, for Approximately 90 Minutes Each, will Speak on a Timely and Specific Topic
Industry News | 2003-03-14 08:18:03.0
The instruction is intended as a practical user's guide for determining if a failure is related to black pad.
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Parts & Supplies | Pick and Place/Feeders
UNIVERSAL INSERT PAD PUSHER WITH PIN, Color: Black 45729301
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
Technical Library | 2023-01-06 16:09:03.0
The 4-14 IPC Standards Committee recently created a revision to the IPC4552 specification for Electroless Nickel/Immersion Gold (ENIG) finished Printed Circuit Boards (PCB). Revision A brings a more comprehensive evaluation of metal layer thicknesses measurement, composition and introduces, for the first time, a quality aspect for nickel corrosion which has been historically connected to a defect called black line nickel or black pad.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Conformal coatings used by electronic manufacturers contain UV indicators for the purpose of inspection. Since coatings are transparent, units must be viewed under black light in order to verify coverage and non-coverage. The Nordson YESTECH FX-940U
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | , Pennsylvania USA | Engineering
Our client is an expanding electronics manufacturing company, we are searching for a hands-on, experienced quality manager. Our client is in need of a proven quality manager to refine their pre-existing quality system. Must have successfully experien
Career Center | Wellsboro, Pennsylvania USA | Engineering
SMT PROCESS ENGINEER: (Wellsboro, PA) - Designs, defines and plans the manufacturing process. Specifies and directs installation of new processes. Plans equipment build schedules and monitors vendor progress. Defines and recommends equipment, methods
Career Center | Toronto, Ontario Canada | Production,Quality Control,Technical Support
HIGHLIGHTS OF QUALIFICATIONS • Over 5 years of experience working as a Technical Support person, Onsite Technician in maintenance and operation of business environment to support business such as inventory of equipments and supplies as well as softw
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
ORION Industries | http://orionindustries.com/pdfs/qpad2.pdf
Grease Replacement Materials without Electrical Isolation Physical Properties Q-PAD II Q-PAD 3 Test Method Color Black Black Visual Thickness Inches .006/.0065 w/ac ±.001.005/.0055 (w/ac) ASTM D374 (mm) .152 ±.025 (.15
KingFei SMT Tech | https://www.smtspare-parts.com/sale-14324537-mc14-000068-pad-vacuum-pfg-3-5a-rubber-pad-samsung-sm-nozzle.html
MC14-000068 Pad Vacuum -PFG-3.5A Rubber Pad Samsung Sm Nozzle Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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