Datum Alloys is an international supplier of speciality metals and special purpose alloys,
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Smt I-pulse K01 nozzle used in pick and place machine Smt I-pulse K01 nozzle used in pick and place machine I-pulse series nozzles: 1.M1/M4 type:M001/M002/M003/M004/M005/M006/M012/M013/M017/M018/M019/M020/M021/M022/M031/M032/M033 2.M2 type:N001/N00
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
Used SMT Equipment | Pick and Place/Feeders
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Used SMT Equipment | THT Equipment
Spare parts for Universal Radial and Axial through-hole insertion machines Model specifications: (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O
Industry News | 2003-03-31 09:51:04.0
The SMTA has formed the SMTA International Technical Committee for 2003.
Industry News | 2003-03-14 08:18:03.0
The instruction is intended as a practical user's guide for determining if a failure is related to black pad.
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Technical Library | 2007-08-16 13:34:31.0
While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.
Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
SMT On-line 3D Solder Paste Inspection If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Mar 29 18:30:00 UTC 2021 - Mon Mar 29 18:30:00 UTC 2021 | ,
Juarez Chapter Webinar: DFM, Design For Manufacturing
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | Waterloo, Ontario Canada | Research and Development
POSITION SUMMARY Reporting into the SMT Process Engineering organization, the successful candidate will be aligned with specific new product introductions and will play a pivotal technical role in the design for manufacturability of these products.
Career Center | , Tirane | Engineering
Process Engineer, Co-Op, R&D (May 2010 to Present) Speedline Technologies, Inc. Franklin MA, United States Research and conduct in-depth analysis for Stencil Printing machines (MPM) manufactured by Speedline Technologies, Inc. for operations i
SMTnet Express, January 12, 2023, Subscribers: 24,747, Companies: 11,692, Users: 27,678 █ Electronics Manufacturing Technical Articles BLACKPAD REVISITED Since the implementation of lead-free soldering, solderability issues appear
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Machine Capability Measurement on SMT Equipment by Romain Schmitt, Jean Marie Guillet - Solectron Technology, Inc. Introduction by Michael Sivigny of EAGLE-EYED ONE
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/txs02612rtwr-footprint-issues_topic2244_post9285.html
TXS02612RTWR Footprint Issues - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login TXS02612RTWR Footprint Issues
ORION Industries | http://orionindustries.com/pdfs/qpad2.pdf
Grease Replacement Materials without Electrical Isolation Physical Properties Q-PAD II Q-PAD 3 Test Method Color Black Black Visual Thickness Inches .006/.0065 w/ac ±.001.005/.0055 (w/ac) ASTM D374 (mm) .152 ±.025 (.15
