Industry Directory | Manufacturer
Enthone is a leading global supplier of high performance specialty chemicals and coatings. Our products provide innovative and cost-effective technology solutions for a wide range of markets and applications worldwide.
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New Equipment | Assembly Services
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Electronics Forum | Tue Feb 04 08:32:49 EST 2003 | roertner
In my experience AOI's are good for checking machine setup I.E. first piece inspection. After that the only things they will typically catch are wrong parts, reversed parts, missing parts, and tombstones. I would however suggest getting an AOI with a
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Industry News | 2003-04-21 10:24:56.0
Learning today for tomorrow's demands
Parts & Supplies | Pick and Place/Feeders
E8601716CA0 CTL BOARD E86017170A0 CTR PWB ASM. E86017170B0 CTL BOARD COMPL. E86017170C0 CTL CIRCUIT BOARD C ASM. E86017170D0 CTL BOARD D ASM E86017210A0 SUB CPU ASM. E86017210B0 SUB CPU PWB SET E8601721AA0 SUB CPU PWB A ASM. E8601721C
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: JUKI Part Name: Jig Nozzle Part Number: 40046647 Material: Tungsten Steel Color: Black Origin: Japan JUKI jig nozzle LNC laser offset 40046647 For KE2000 Series Black Color Description: 1, Part Name: Jig No
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Career Center | , | 2013-03-07 05:50:27.0
Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/priming?con=t&page=18
. Our priming systems are designed to dispense a variety of substrates, including both clear and black primers in a way that increases throughput and yields to reduce production costs
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
facilitate void generation in the solder joints. Table 3 lists the specific micro-via design data for each component on the test vehicle. Through-holes were arranged along one side of the test vehicle for ease of organizing cabling to the PWB. Instead of using
