Industry Directory: black spot during soldering (1)

Datum Alloys Ltd

Industry Directory |

Datum Alloys is an international supplier of speciality metals and special purpose alloys,

New SMT Equipment: black spot during soldering (206)

china brand new reflow oven 8zone 6 3 10 zone reflow oven

china brand new reflow oven 8zone 6 3 10 zone reflow oven

New Equipment | Reflow

china brand new reflow oven 8zone 6 3 10 zone reflow oven china brand new reflow oven 8zone 6 3 10 zone reflow oven Email:info@smtlinemachine.com Skype:smtdwx M/P/Whatsapp/wechat:+8615915451009 WWW.smtlinemachine.com Panasonic CM402 nozzle NP

CNSMT CO.LTD

wave soldering Equipment

wave soldering Equipment

New Equipment | Wave Soldering

http://www.flason-smt.com/product/wave-soldering-Equipment.html wave soldering Equipment Weight: 1100KG Dimensions: 3300(L)*1400(W)*1560(H) spray fashion: SMC+ST 6 nozzle Heating zone Length: 1600mm Product description: wave soldering Equipme

Flason Electronic Co.,limited

Electronics Forum: black spot during soldering (110)

Black spot on Gold Pads

Electronics Forum | Sat Nov 25 18:45:19 EST 2000 | Ashok Dhawan

I am getting black spots / stuff while I run gold finish PCB through reflow soldering process using NC solder paste.The affected spots have intermetalic as black in color. Does not solder very well. I did look at the archieve but could not find info

Re: Black spot on Gold Pads

Electronics Forum | Tue Nov 28 21:07:44 EST 2000 | Alvin K

Gold is porous and spots on gold plated PCBs is one of the drawbacks of using gold as a solderability protector. Base Nickel exposure seems to be the cause of this and is aggravated when the gold thickness is less than what it should be. I agree with

Industry News: black spot during soldering (100)

PCB Test Point Provide Easy Component Access

Industry News | 2003-06-13 09:56:46.0

Wire and spring specialist William Hughes can now offer three different versions of its PCB test point - small, large and long-legged in quantities suitable for prototype work or volume production.

SMTnet

MIRTEC to Unveil Revolutionary Inspection Technologies for Perfect Solder Joints and 30% Productivity Boost at productronica

Industry News | 2023-11-13 12:28:17.0

MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.

MIRTEC Corp

Parts & Supplies: black spot during soldering (3)

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

Yamaha YS24 Track Mounter Table Y Axi

Yamaha YS24 Track Mounter Table Y Axi

Parts & Supplies | Assembly Accessories

YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 We also supply the below products: KHY-M71G5-A0 Z UNIT ASSY. YS12 Z-axis motor YG12 Z

KingFei SMT Tech

Technical Library: black spot during soldering (2)

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

Technical Library | 2011-09-22 16:30:11.0

The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens).

IRphotonics

Solving the ENIG Black Pad Problem: An ITRI Report on Round 2

Technical Library | 2013-01-17 15:37:21.0

A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.

Celestica Corporation

Videos: black spot during soldering (8)

I.C.T | AOI Optical Inspection Machine For SMT Components and DIP Solder Joint

I.C.T | AOI Optical Inspection Machine For SMT Components and DIP Solder Joint

Videos

I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir

Dongguan Intercontinental Technology Co., Ltd.

CS-400E Contact Systems Component Locator Placement Rate Demo

CS-400E Contact Systems Component Locator Placement Rate Demo

Videos

Contact Systems Component Locator for Through-hole electronic assembly CS-400E Placement Rate Demo

Versatec

Events Calendar: black spot during soldering (2)

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1

Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1

Surface Mount Technology Association (SMTA)

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2

Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2

Surface Mount Technology Association (SMTA)

Career Center - Resumes: black spot during soldering (5)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Manufacturing, Industrial, Process, Production

Career Center | Mayaguez, Puerto Rico | Engineering,Production

Detail oriented and goes to great lengths to insure that the products are meeting and exceeding customer expectations. Place procedures and training in place to provide former company with techniques for ISO 9001:2008 and QS 9000. Assist design engi

Express Newsletter: black spot during soldering (1020)

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effect of Reflow Profile on SnPb and SnAgCu Solder

Partner Websites: black spot during soldering (100)

UV Curing Dispense Pumps

GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-curing-application.php

. Typically, UV curable adhesives are optically clear so sensor arrays inside encapsulant remain visible. UV Curable materials come in dark amber or black syringes to block UV light

GPD Global

ASYMTEK Select Coat Applicator Series

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/products/electronics-solutions-products/asymtek-select-coat-applicator-series

ASYMTEK Select Coat Applicator Series Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar

ASYMTEK Products | Nordson Electronics Solutions


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