Electronics Forum | Wed Feb 11 14:55:52 EST 2015 | erezah
we received assembled PCBs with spots that look like a bleach spots all over the PS and CS . The board house said that this is normal due to flux aqueous wash process. Can it cause problems (e.g. corrosion ) in the long run or cause issues when wor
Electronics Forum | Thu Feb 12 08:35:22 EST 2015 | davef
Solder mask is intended to protect the traces from the soldering process. That's it. [Tried to upload a picture. It's broken.]
Industry News | 2016-10-06 10:00:54.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, IL. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Parts & Supplies | SMT Equipment
H04 and H12, Nozzle body & core are used import white steel by precision grinding in Japan after the rough grinding,H01,used import aluminum alloy after rough grinding; transposon control the pore size within ± 0.003MM,cores clearance fit with the tr
Parts & Supplies | SMT Equipment
H04 and H12, Nozzle body & core are used import white steel by precision grinding in Japan after the rough grinding,H01,used import aluminum alloy after rough grinding; transposon control the pore size within ± 0.003MM,cores clearance fit with the tr
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
Swiftmode's Hyperclean Under Stencil SMT Wiper Rolls are the only product in the market that has beed developed specifically for the application. Best vacuum performance, less IPA usage and No loose fibres making the solder paste printing process mor
