Industry Directory | Consultant / Service Provider / Manufacturer
PCB-supplier, Flexprint, HDI, Microvia, blind via, burried vias ect.
Industry Directory | Manufacturer
Manufacturer of flex, rigid-flex, and rigid circuit boards. We offer prototype and production delivery options. We manufacture commercial, military, medical and industrial jobs and offer value added services such as assembly. We can customize services to fit your needs, such as gold or white tin plating, plugged or blind vias, etc.
New Equipment | Assembly Services
We are Professional in PCB Manufacturing, PCB Fabrication, PCB Making! Hitech Circuits Co., Limited – Experienced PCB manufacturer from China. Our PCB manufacturing services will allow you to be the most competitive player in your market. Please che
Materials: FR-4 Layer count: 8 layers with blind/buried VIAs Min. VIAs: 10 mil Min. line: 5 mil Application: Printing controller Finishing: HAL
Electronics Forum | Fri Jul 30 14:16:11 EDT 2004 | C.W
For VIA In PAD design, what's the difference between a thru vias and a blind via? thanks' chester
Electronics Forum | Fri Jul 30 14:21:36 EDT 2004 | C.W
what's the difference between a thru vias and a blind via?
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Parts & Supplies | Circuit Board Assembly Products
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin
Parts & Supplies | Circuit Board Assembly Products
1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm，6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish
Technical Library | 2013-03-07 18:25:36.0
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Career Center | Dana Point, California USA | Sales/Marketing
We are currently seeking sales reps nationwide for this rapidly growing supplier of printed circuit boards (since 1986)with facilities in southern CA and eight PCB facilities in China and Taiwan, all ISO 9002 certified and UL94V-0 approved, some are
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express March 7, 2013, Subscribers: 26214, Members: Companies: 13311, Users: 34412 PTH Core-to-Core Interconnect Using Sintered Conductive Pastes The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias
SMTnet Express, July 18, 2019, Subscribers: 32,162, Companies: 10,836, Users: 24,951 Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution Credits: MacDermid Inc. The increased demand for electronic devices in recent years
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/pcb-manufacturing
. It also allows metalization to the inner layers by removing resin smear created in the drilling process and removes carbon byproducts from blind vias. Desmear
