Industry Directory | Manufacturer / Media / Publisher / Online Resource / Training Provider
Endodontic NiTi File Manufacturing Machine Supply || Grinder || Assembly || Heat-treatment Your Gateway to Endo Niti File Manufacturing Excellence!
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
New Equipment | Curing Equipment
Designed for Conformal Coatings and other Curing applications. LEL Protection. High Solvents, High Solids, Humidity Curing. High Volume Production. Large Area Filters. Reel to Reel Foil Drip liner and removable drip pans for easy maintenance. Convect
Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant
Electronics Forum | Thu Feb 15 22:55:45 EST 2007 | davef
Questions are: * Is the blistering in the solder mask or the laminate? * If the blistering is in the solder mask, what do the blisters look like [eg, size, quantity, distribution, etc]? * If the blistering is in the laminate, what do the blisters loo
Electronics Forum | Wed Feb 21 05:52:17 EST 2007 | Stephen- SMT engineer trainee
Some of the blister in solder mask, normally 1 circle blister(about 1cm in Dim.) in each PCB. In addition, there are also blister in laminate, the also look like 1 circle blister(about 1cm in Dim.) in each PCB.
Industry News | 2016-12-29 06:43:55.0
Conformal Coating Photo Album CD-ROM The photo CD-ROM album featuring over 280 colour images on conformal coating, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents and standards. The photo CD covers many of the defects listed:
Industry News | 2009-01-30 18:39:51.0
S-series tape feeders have been one of the most important components of many Siplace placement machines for many years. With its new 3x8 mm shutterless S-feeder, Siemens Electronics Assembly Systems (SEAS) now presents another improved version in the series. Fewer movable parts mean longer life and more reliability. The new feeder also handles a broader spectrum of components and makes the user's job easier. As a special benefit, owners of classic 3x8 mm feeders can have them upgraded to the shutterless version.
Parts & Supplies | Pick and Place/Feeders
Ceram Pads 2x2mm (Blister Tape)
Technical Library | 2022-01-26 15:22:33.0
Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented experimentally: adhesion strength and puncture strength. A modified blister test using a predefined blister area is employed to assess the adhesion strength and a puncture test is employed to evaluate the puncture strength of the coating. After measuring the properties at time zero, the coatings are subjected to accelerated testing conditions (high temperature/humidity storage and temperature cycling) and the degradations of the coating properties are documented.
Technical Library | 2017-12-11 22:31:06.0
Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.
03062054-02 Barcodelable S27 Sector 1 (left) 03062055-02 Barcodelable S27 Sector 1 (right) 03062164-01 Handscanner Dragon D131 complete 03062165-01 CABLE Handscanner D131 03062222-01 O-Ring DIN 3771 - 40 X 1,5 - N - EPDM 70 030629
00367018-02 TEST CABLE X2 00367019-02 TEST CABLE X3 00367071-01 Oil Dispenser z-Axis STRUCTVIS GHD 7ml 00367142S04 COMP.SENSOR SP-12 COMPL. 00367174-02 MOTOR WITH SYNCHRONIZING DISK 00367216-04 SIPLACE line utility box (10/2004) 00367237-01 GA
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/controllers-and-control-systems/ecoliner-temperature-control-system
. By minimizing variances in temperature, the system stabilizes applied compound weights, helping you reduce material waste, decrease operating costs and eliminate blistering for better product quality
| http://etasmt.com/cc?ID=te_news_bulletin,20361&url=_print
. The small reflow soldering machine must not be too long and the temperature is too high to cause copper and platinum blistering; the solder joints must be smooth and bright, and the circuit board must be tinned