New Equipment | Solder Materials
16 hours), and abandon time (>8 hours) Improved paste transfer efficiency Printing: Suitable for high speed printing up to 125 mms-1 Improved reflow process window (high soak temperatures and time) with superior coalescence and wetting Very shiny
Electronics Forum | Thu Oct 31 11:08:12 EST 2002 | soupatech
Being very new to SMT I won't assume I know what the problem is but.... I had lots of air pockets in solder joints, 95% of the boards. Everyone I spoke to thought it was a problem with my process but when one board was sent to our supplier they admi
Electronics Forum | Thu Mar 10 14:31:57 EST 2005 | russ
Patrick told you why, But here is some more info for ya, I would absolutely not recommend that wires be tinned with OA. The residue will never get cleaned underneath the insulation and all of your strands will strt to break in the near/far future.
Industry News | 2017-08-26 20:18:39.0
SMTA and SMART Group are excited to announce plans to co-organize the Electronics in Harsh Environments Conference. The event will be held April 24-26, 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments.
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Article Return to Front Page No-Residue Technolo
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
Solder Ball Defects - Heller Home » Solder Ball Defects Re-printed in partnership with ITM Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint
| https://www.eptac.com/soldertips/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/
. Depending upon the flux type used, flux is usually removed so there are no visible film residues evident on the solder connections. It also makes it easier to inspect the solder joints if the flux residues are cleaned off
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