Electronics Forum | Fri Sep 25 17:01:41 EDT 1998 | Steve Gregory
O-H-H-H-H-H-H-H Lawdy, lawdy... My babuh done left me... my dawg pee'd on my leg... my cornflakes are all poopy... don't make me hafta beg... I got's dem backplane blues, o-h-h-h-h-h lawdy..." OH! Hi there! Scared me fer a second...heheh....caugh
Electronics Forum | Fri Sep 25 22:00:22 EDT 1998 | Mike C
| O-H-H-H-H-H-H-H Lawdy, lawdy... | My babuh done left me... | my dawg pee'd on my leg... | my cornflakes are all poopy... | don't make me hafta beg... | I got's dem backplane blues, o-h-h-h-h-h lawdy..." | OH! | | Hi there! Scared me fer a secon
Industry News | 2017-05-09 15:32:04.0
Viscom is pleased to announce that it has been awarded a 2017 EM Asia Innovation Award in the category of Test Measurement / Inspection System: AOI for the S3088 ultra blue. The award was presented to the company during an April 26, 2017 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. This marks the company’s second award in Asia for the system, following the SMT China Vision Award ceremony the day before.
Industry News | 2017-01-29 09:07:54.0
At the upcoming IPC APEX EXPO, Viscom will present the latest generation of its inspection systems and solutions. The show is scheduled to take place Feb. 14–16, 2017 at the San Diego Convention Center, California, USA. Special highlights are the advanced 3D AOI with 360View, precise AOI for coating inspection, and the tried and tested X7056 3D AXI system. Last but not least: the new Viscom App for mobile devices will be presented.
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu
| http://etasmt.com:9060/te_news_industry/2021-10-14/26961.chtml
. It was originally colorless or yellowish-brown and transparent. It is often sold in the market by adding colorants to red, yellow, black, green, brown, blue and other colors, and it is in the form of granules and powder
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/2d-x-ray-inspection
. In many cases, X-Ray inspection (2D and 3D) provides the only non-destructive techniques to inspect optically hidden components and solder joints such as BGA, POP, QFN, flip chips, through holes, TSVs, micro-bumps, copper pillars, etc
