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BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
Petroferm offers a complete line of aqueous and semi-aqueous cleaning chemistries for use in batch and inline spray-in-air cleaning equipment. These cleaning materials are used for defluxing (removing post reflow solder paste residues) circuit boards
Electronics Forum | Wed Jun 13 16:09:28 EDT 2007 | rgduval
The parts were soldered in place on the first side. Any recommendations on material for this kind of fixture? I've shimmed boards off the belt before with titanium wave plows...but, I'd love to find something slightly more elegant.
Electronics Forum | Thu Jun 14 04:08:33 EDT 2007 | d0min0
we had same problems with heavy loaded boards (40 x 10 leg transformer each side) we placed 2 glue dots (Fuji GL)under trafo and played with profile bottom side (thermateh lcv4 - 6 zones, SnPb process) that did the trick
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Technical Library | 2023-09-23 22:29:02.0
Moisture trapped within components and PBs presents a serious problem during the fabrication and assembly process. Too much moisture can lead to board failures when it is turned to steam during the reflow process.
Technical Library | 2020-11-24 23:12:27.0
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
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Heller Industries Inc. | https://hellerindustries.com/parts/803558-01/
803558-01 - Short CBS Rail in board Entrance N2 Oven Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
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