New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
New Equipment | Industrial Automation
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Electronics Forum | Wed Aug 17 22:41:37 EDT 2005 | davef
Peter are you having fun with solder masks erwat? We saw this years ago with LPI solder masks. It shows occasionally with other masks. We agree with Russ. If nothing [eg, alcohol, flux thinner, acetonitrile, or water] dissolves the haze, then it
Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Industry News | 2015-11-04 04:29:38.0
Nordson ASYMTEK unveils systems with new process controls and features that make fluid dispensing and conformal coating as easy as Ready, Set, Jet. See the demonstrations at Productronica, stand A2.461.
Industry News | 2008-03-20 13:29:37.0
Minneapolis, MN� The SMTA Annual Meeting and Awards Ceremony at SMTAI, August 20, 2008, will feature IBM Vice President, Dr. Sharon Nunes as the keynote speaker. Dr. Nunes is currently Vice President of Big Green Innovations at IBM Systems & Technology Group (STG). Big Green Innovations is a new program at IBM that was commissioned by the chairman at the end of 2006. Its mission is to use information technology to address critical environmental problems around the world.
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-has-successfully-pioneered-groundbreaking-two-segment-board-handling-technology
Nordson SELECT has Successfully Pioneered Groundbreaking Two Segment Board Handling Technology SELECT Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Overview - All Novo 460 Cerno
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/has-ipc-validated-this-tool_topic745_post2637.html
. It looks like a great tool. Currently though, I'm using LP Calculator which is the software that ships with IPC7351. I understand from John Perry at IPC that LPC Calculator is
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