Industry Directory | Consultant / Service Provider / Manufacturer / Other
Masach Tech specializes in board level EMI/RFI shielding design and production. Founded in 1994, Masach is a globally recognized and leading supplier of some of the world’s largest electronic companies, driven by highest quality..
Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
Electronics Forum | Tue Feb 14 09:10:43 EST 2017 | davef
Assuming the traces run parallel and perpendicular to each other, I'd choose one direction the traces run as "x" and the other direction for "y." Then I'd pick a unique identifier on the board to insure proper orientation. Next, I'd measure warp and
Electronics Forum | Thu Jun 27 17:24:17 EDT 2002 | Daan Terstegge
Never did a DOE on that, but I think it would be quite difficult to warp a board inside the oven if it was flat when it entered the machine. If there's no center-board support then it's another story, then the board will bend due to it's own weight.
Used SMT Equipment | Soldering - Selective
Make: Nordson Model: Select Novo 102 Vintage: 2020 Description: Selective Solder Details: Lead-Free Titanium Solder Pot & Pump Assembly Solder Pot Capacity: 30 lbs Software: SWAK-OS 4.0 (Includes Automated Fiducial Alignment, Board Warp Compensa
Used SMT Equipment | AOI / Automated Optical Inspection
Saki BF-Frontier AOI System Model BF-Frontier Vintage: 12/2006 Board Thickness: 0.6 - 2.5mm, 24 - 100mils Board Warp: +/-2mm, 79mils PCB Clearance; Top: 40mm, 1.57in Bottom: 40mm, 1.57in Inspection Categories: Presence/Absence, Misalignment, Tomb sto
Industry News | 2019-09-03 11:13:26.0
IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.
Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
Parts & Supplies | Chipshooters / Chip Mounters
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Parts & Supplies | Pick and Place/Feeders
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Technical Library | 2024-10-26 06:26:24.0
Copper pour is an essential design element in printed circuit boards (PCBs) that enhances thermal management, signal integrity, and electrical grounding. It involves filling unused areas on the board with copper, connecting them to power or ground planes. This feature helps manage heat dissipation, minimizes electromagnetic interference (EMI), and provides stable electrical grounding for complex circuits. While copper pour offers significant benefits, improper implementation may lead to manufacturing challenges like warping or soldering difficulties. This article explores the advantages of copper pour, the potential challenges, and how PCB Power integrates this design feature to optimize performance and durability. With advanced manufacturing processes, PCB Power ensures seamless copper pour integration for prototypes and large-scale production, offering turnkey PCB solutions for various industries.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
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Events Calendar | Thu Nov 15 00:00:00 EST 2018 - Thu Nov 15 00:00:00 EST 2018 | ,
Printed Circuit Cards and Modeling System Effects
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL
Imagineering, Inc. | https://www.pcbnet.com/services/assembly/turn-key/
Full Turnkey Printed Circuit Board (PCB) Assembly | Imagineering Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances
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