New Equipment | Education/Training
All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s
New Equipment | Education/Training
Our web based seminars represent an efficient way for you and your team to develop practical knowledge, delivering expert advice and guidance to you where, when and how you choose. Simple webinars offer a low cost and time efficient training option.
Electronics Forum | Fri Jul 21 08:11:16 EDT 2000 | Michael Bryant
I have included a link to the Bob Willis OnBoard Forum at the bottom of this message. You can always look at any of the past forums by clicking the 'OnBoard Forums' link at the top of every SMTnet page.
Electronics Forum | Fri Jul 21 17:38:05 EDT 2000 | armintan
hey Bob, can i request one? thanks.
Industry News | 2003-02-05 09:14:02.0
The Event will be Held in the Wyndham San Jose Hotel on February 20, 2003
Industry News | 2020-03-25 11:55:11.0
The Surface Mount Technology Association (SMTA) announced the recent release of Selective Soldering 101, the latest in a series of online training courses on the fundamentals of electronics assembly. The course will be useful for equipment operators, technicians, and engineers new to the industry that want to understand more about the soldering process and who have a basic familiarity with the equipment.
Technical Library | 2021-12-16 01:33:11.0
Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly.
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Welcome to this Defect of the Month video on simple solderability testing, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years th
Welcome to this Bob Willis Defect of the Month video on BGA inspection, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years there
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 06 00:00:00 EDT 2020 - Mon Apr 06 00:00:00 EDT 2020 | ,
Reflow Simulation – X-ray & Optical Help Solves Design & Process
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Bob Willis, Electronic Presentation Services Title: Green Electronics
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech.cfm
: Mike Bixenman, DBA, KYZEN Corporation Richard Boyle, Henkel Electronics Nigel Burtt, Renishaw plc Richard Coyle, Ph.D., Nokia Bell Labs Maurice Dore, Valeo Detection Vision Systems Bob Willis
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_solder-paste-for-th-component_topic179.xml
(PIHR)?Here is a link from Bob Willis article.http://www.smtnet.com/bob-willis/pihirp.html Solder paste for TH component : Hi Tom, I agree with you and... Author: NightwishSubject: 179Posted: 29 May 2012 at 1:06amHi Tom,
