This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for
One of three Interactive CD-ROMs developed for Soldertec Global by Bob Willis to assist engineers with the practical introduction of lead-free materials and processes. Introduced by Kay Nimmo, Technical Director, Tin Technology, the CD provides a ste
Electronics Forum | Mon Apr 29 02:55:59 EDT 2002 | Bob Willis
Many thanks for the name check Frank but its http://www.bobwillis.co.uk not eps.com Any suggestions recomendation on topics to include to up date the wave soldering set guide would be appriciated. Bob Willis
Electronics Forum | Fri Jul 10 14:40:12 EDT 1998 | Bob Willis
Yes this can be a killer. Its caused by glues with a high water content or fast curing of glues. When you get solder going through the glue it is litterally sucked in during solder wave contact. If you have never seen it you would never believe it bu
Industry News | 2003-02-05 09:14:02.0
The Event will be Held in the Wyndham San Jose Hotel on February 20, 2003
Industry News | 2023-11-27 12:45:07.0
The Surface Mount Technology Association (SMTA) announces the release of several more webinars, photo libraries, and poster sets as part of a generous donation from renowned industry expert, Bob Willis.
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Parts & Supplies | SMT Equipment
J7153382A CABLE SUPPORT F J7153384A CABLE BACK POST J6099013A POSITION PLUNGER J6504015A CABLE BEYOR J6701080A AIR CYLINDER J3104017A STEP MOTOR J6601051A BALL BUSH J6601057A LM SHAFT J6602045A BELT-WORKING J67011001A EDGE_FIXER_CYLINDER J7
Parts & Supplies | Pick and Place/Feeders
Samsung CP45 multi cylinder J6701033B CD05-000030 MOTHERBOARD,CPU-NuPRO-E340;SBC,Q67 EP07-000205 J31051003A CPU Cooler EP12-000030A MTSMUP-HD022A-FOLDING_MIRROR FC09-001517A MIRROR_PLATE FC09-001518A MIRROR_CLAMP_1 FC09-001519A MIRROR_CLAMP_2
Technical Library | 2021-12-16 01:33:11.0
Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly.
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Welcome to this Bob Willis Defect of the Month video on BGA inspection, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years there
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon May 10 00:00:00 EDT 2021 - Mon May 10 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Manual Cleaning of Printed Board Assemblies – Step by Step Guide
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
. Mike Bixenman and Ram Wissel Free! 2019 Harsh Environment Failure - Causes & Cures Keith Bryant & Bob Willis Free! 2019 BGA and Area Array Process Defects - Causes & Cures Keith Bryant Free! 2018
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_solder-paste-for-th-component_topic179.xml
(PIHR)?Here is a link from Bob Willis article.http://www.smtnet.com/bob-willis/pihirp.html Solder paste for TH component : Hi Tom, I agree with you and... Author: NightwishSubject: 179Posted: 29 May 2012 at 1:06amHi Tom,
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