Industry Directory: bondability (2)

West-Tech Materials

Industry Directory | Manufacturer's Representative

Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi

Shenzhen Dihe Electronic Co., Ltd.

Industry Directory | Manufacturer

1-20 layers PCB manufacturer, focusing on metal core pcb, multi-layer PCB, fast PCB and middle-small batch PCB. Min. circuit width & spacing: 3mil. UL, ISO9001, ROHS,ISO14001 certified.

New SMT Equipment: bondability (5)

HANDY & HARMAN

New Equipment |  

Reel-to-reel plating; Wire bondable Gold, Silver, Copper, Nickel,...

West-Tech Materials

Multichip modules (MCM-L)

New Equipment |  

Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.

Metro Circuits, div. of PJC Technologies, Inc.

Electronics Forum: bondability (6)

Immersion Silver Reliability

Electronics Forum | Tue Apr 20 17:19:38 EDT 2004 | Mike

1. Which manufacturers have proven the immersion silver is reliable after solder joint assembly? 2. Who has published guidelines for storing and handling immersion silver boards? 3. Is the immersion silver finish wire bondable? epoxy bondable? or j

Immersion Silver Reliability

Electronics Forum | Tue Apr 20 19:34:13 EDT 2004 | Ken

ImAg is the Surface finish of choice for Intel mother boards....Tin/lead and lead free processes. I think palladium and soft gold are the preferred for wire bondable apps.

Industry News: bondability (7)

Long-time IPC Volunteer, Patricia Goldman Inducted Into IPC Hall of Fame

Industry News | 2016-03-18 11:53:18.0

In recognition of her extraordinary contributions to IPC and the electronics industry, Patricia (Patty) Goldman, managing editor, I-Connect007, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® at the Las Vegas Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.

Association Connecting Electronics Industries (IPC)

Gold Plating Services in Santa Clara CA Installs Technic ENEPIG Process

Industry News | 2016-06-10 09:45:09.0

Cranston RI - Technic is pleased to announce the installation of the TechniPad Electroless Palladium process AT7015 at Gold Plating Services (GPS) in Santa Clara CA. GPS is a contract plating service specializing in precious metal plating for the printed circuit board industry.

Technic Inc.

Technical Library: bondability (3)

Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift

Technical Library | 2017-09-07 13:56:11.0

As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.

Teledyne DALSA

High Phosphorus ENIG – highest resistance against corrosive environment

Technical Library | 2023-01-10 20:15:42.0

Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.

Atotech

Events Calendar: bondability (1)

Risk Analysis in Electronic Assemblies

Events Calendar | Tue Sep 22 00:00:00 EDT 2020 - Tue Sep 22 00:00:00 EDT 2020 | Eden Prairie, Minnesota USA

Risk Analysis in Electronic Assemblies

Surface Mount Technology Association (SMTA)

Express Newsletter: bondability (3)

Partner Websites: bondability (6)

Everything You Need to Know About PCB Finish | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/

) offer benefits such as having greater wire bondability, tighter pitch, and contact usage. However, as you would expect from anything made of gold, these types of finishes are significantly more expensive

Imagineering, Inc.

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

Technical Cleanliness) Special risk on RF assemblies? Case Study: Evaluation of Bondability on ENEPIG surfaces Forecast and Perspectives About the Presenter Stefan Strixner has a Master of Science in Technical Chemistry and supports customers since foundation

Surface Mount Technology Association (SMTA)


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