New Equipment | Soldering Robots
HSC Hot Bar Soldering Machine with Smart Thermode,FPC Hotbar Bonder,FFC Hotbar Welding CW-2A2B: Fpc Pulse Heat Bonding-the Result of Flexible Circuit Board Hotbar Soldering Pulse Heat Hot-bar Soldering,CW-2A2B Spec
New Equipment | Soldering Robots
FFC FPC to PCB Bonding Machine HSC WelidingMachine,CW-2A2P Working Picture: FFC FPC to PCB Bonding Machine HSC WelidingMachine,CW-2A2P Simple introduction: This device is designed for double - deck working mode of double welding he
Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag
does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.
Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel
Used SMT Equipment | SMT Equipment
Auction: Phoenix X-Ray PCB Analyser, Wafer Probers, Test Chambers, Hot Bar Bonders, Dicing Saws & More Featuring: BAE - Manassas, Virginia USA • V.J. Technologies VJ-1000 X-Ray System A World Class Semiconductor Mfg. Co. - Hayward, California USA
Used SMT Equipment | Pick and Place/Feeders
Flexible Production High PCB handling capacity in a medium speed bonder 510 x 510mm (standard) / 1500 x 460mm (option) - PCBs of 1,500mm(L) x 460mm(W) size can be produced High Reliability Stable mounting of microchips Automatic calibration is perf
Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Industry News | 2014-06-03 13:04:15.0
The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.
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Parts & Supplies | Chipshooters / Chip Mounters
N510067153AA N510012402AA SMT Panasonic Bonder BM Head Solenoid Valve Original Brand New KXF0DKDAA00 KXF0DKCAA00 KXF0DKFAA00 KXF0DKEAA00 KXF0DKGAA00 N510004586AA N510023795AA KXF0DGKAA00/CS8420i-20, KXF0DZJ2A00 N610001944AB N610001943AB/ N61
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Parts & Supplies | Pick and Place/Feeders
KXFW1KS5A00 SMT automatic bonder Panasonic CM602 402 8mm feeder CM402CM602 8mm8MM:KXF0DWTKA00 12MM:KXF0DWTLA00 CM402 CM602 NPM 8MMKXFA1PQ9A00 CM402 CM602 NPM 8mmKXFA1PR0A00 N210109641AA KXFA1MQBA01 KXFA1MPBA01 KXFA1MPBA0 CM402 CM602 NPM 12\16M
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
Flip Chip Thermosonic Bonding with the FINEPLACER® pico MA. http://eu.finetech.de/micro-assembly/products/fineplacerr-pico-ma.html More information about Thermosonic bonding: http://eu.finetech.de/micro-assembly/technologies/ultrasonic-thermosonic-b
Career Center | Melbourne, Florida USA | Engineering,Production,Quality Control
Engineering Specialist - Advanced Manufacturing Technology organization Palm Bay, Florida � GCSD01041082 Job Description: Work in the Advanced Manufacturing Technology organization on the development, qualification, and implementation of leading-edg
Career Center | San Jose, California USA | Research and Development
Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
Career Center | , Philippines | Engineering,Technical Support
Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_semiconductor_esec3006.html
ESEC 3006 ESEC Sempac Wire Bonder Model # 3006S Type W112 Fab No 300357 Year 1999-2000 1.44 MB Floppy Olympus Microscope-Model SZ30
| https://www.smtfactory.com/Samsung-Pick-And-Place-Machine-Development-History-id40845177.html
: Launched CP-11 high-speed pick and place machine development, launched SWB--100G wire bonder 1996: Launched medium-speed CP--30 high-speed pick and place machine
