http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product descrip
http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product des
Industry News | 2013-06-20 19:31:51.0
Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.
Industry News | 2012-05-11 20:19:04.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Career Center | Toronto,, Ontario Canada | Engineering,Research and Development
DEBTANU BASU 40 Fountain Head Road Toronto, ON M3J2V1 (416) 514 0619 Cell: 416 258 7488 E-mail: debtanubasu@aol.com With more than six years of experience in the field of flip chip technologies seeking a challenging technical position in the field
