Industry Directory | Manufacturer
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
Industry Directory | Manufacturer
Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds. Master Bond specializes in epoxies, silicones and uv curable polymer systems.
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Thu Oct 07 14:40:31 EDT 1999 | Carol Zhang
I have a board, 4 spacers needed to be soldered on the board first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there will be no p
Electronics Forum | Thu Sep 04 02:43:09 EDT 2008 | benefon
Thanks This error only occurred with one oven profile with the reflow zone temperature set at 270�C. Perhaps it really has to do with the exhaust pull as the oven is operating very near its temperature limit with this profile. I will check that. Tha
Used SMT Equipment | SMT Equipment
Product name: KD - 775 JUKI chip mounter Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standard equipped with three dispensing head, achieved 0.1 seconds/launch daub adhesive at a high speed. Stable quality stand
Used SMT Equipment | Pick and Place/Feeders
Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standardequipped with three dispensing head, achieved 0.1 seconds/launch daub adhesiveat a high speed. Stable quality standards are equipped witheven daub glue residual wi
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Parts & Supplies | Pick and Place/Feeders
Base size Max 410 × 360mm Min 50 × 30mm Smudge speed 0.1 seconds / launch(best conditions) Smudge accuracy ± 0.15 mm Needle type 30cc Set the smear angle 0 ° ~ 359 °(1 ° unit) A redesigned dot head. The standard
Parts & Supplies | Assembly Accessories
NO. GREASE MODEL PACKAGING 1 Three Bond 2706 Oil & Grease Removing Agent 420ML/PC 10PC/Carton 2 BIRAL T&D spary lubricant 500ML/PC 12PC/Carton 3 BIRAL VG-HT spary lubricant 500ML/PC 12PC/Carton 4 BIRAL BIO-30 high temperature chain oil 1000G
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Apr 07 00:00:00 EDT 2020 - Tue Apr 07 00:00:00 EDT 2020 | ,
Harsh Environment Failure - Causes & Cures - FREE Pre-Conference Webinar
Career Center | New Castle, Pennsylvania USA | Production
Surface Mount Tech - Printed Circuit Board (PCB) Summary: **All applicants must be familiar with: Quad 4C equipment*** Will be responsible for Surface Mount Parts and Screen Printing Other responsibilities may include: Moves controls to activate
Career Center | BIDDEFORD, Maine USA | Engineering,Maintenance
Searching for a Facilities Engineer with a strong Mechanical and/or Industrial background. Experience facilitating the design of machinery and equipment in a fast paced environment required. Strong knowledge of facilities and building maintenance a
Career Center | la jolla, California USA | Engineering
More than 18 years experience in AOI. Refer to my resume for more details.
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
Article Return to Front Page A Low Temperature Alte
Heller Industries Inc. | https://hellerindustries.com/parts/800448/
800448 - High Temperature Filter IBM. Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
High Temperature PCB: Considerations for High-Heat Applications Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials
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